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Assembling equipment and system

A technology for assembling equipment and pressing devices, which is applied in the direction of mechanical equipment, material gluing, connecting components, etc., and can solve the problem of low sensor installation accuracy

Pending Publication Date: 2020-05-15
湃瑞电子科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide an assembly equipment and system to solve the problem of low sensor installation accuracy in the traditional setting that relies solely on pressure and temperature

Method used

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Examples

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no. 1 example

[0024] Such as figure 1 As shown, the embodiment of the present application provides an assembly equipment, the assembly equipment includes a base 10, a heating and pressing mechanism 20 and a controller 30, a device to be pressed is placed on the base 10, and the device to be pressed includes a first Part A, hot melt B, pressure sensor C and second part D, the hot melt B is placed on the first part A, and the hot melt B wraps the pressure sensor C to be assembled. A second part D is placed on the upper part of the pressure sensor C and the hot melt B, and the heating and pressing mechanism 20 is arranged above the second part D, and the heating and pressing mechanism 20 and the pressure sensor C to be assembled are connected with the control device 30 is electrically connected.

[0025] When assembling the assembly equipment designed above, the controller 30 will obtain the initial displacement signal and temperature signal transmitted from the outside, and the force feedbac...

no. 2 example

[0040] The present application provides an assembly system, the system includes an input device and the assembly device described in any optional implementation manner in the first embodiment, the assembly device includes a base, a heating and pressing mechanism and a controller, the input device and The controller is electrically connected, and the input device can be used to receive the operation of the staff to input initial temperature parameters to the controller, etc., and its specific functions and functions are consistent with those described in the first embodiment, and will not be repeated here. .

[0041] In the assembly system designed above, during the assembly process of the pressure sensor, the force parameters of the pressure sensor to be assembled are used as the controller to control the force factor of the heating and pressing device, so that the controller continuously controls the pressure value of the heating and pressing mechanism. Changes, and then make...

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Abstract

The invention provides an assembling equipment and system. The assembling equipment comprises a base, a heating and pressing mechanism and a controller. The base is used for allowing a to-be-pressed device to be placed thereon. The to-be-pressed device comprises a first component placed on the base, a pressure sensor arranged on the first component, hot melt arranged on the first component and used for wrapping the pressure sensor and a second component arranged on the hot melt. The heating and pressing mechanism is arranged above the base and is used for heating the second component and applying pressure in the base direction. The controller is electrically connected with the heating and pressing mechanism and the pressure sensor and is used for controlling the value of the pressure applied by the heating and pressing mechanism to the second component according to detection parameters of the pressure sensor.

Description

technical field [0001] The present application relates to the field of device assembly, in particular, to an assembly device and system. Background technique [0002] The traditional way to assemble the sensor in the middle of the part is to fix the sensor with hot melt adhesive by setting the pressure and temperature. However, the pressure and displacement changes of the existing miniature pressure sensors are very small. In addition, the rheology of the hot melt adhesive is complicated during hot pressing, and there is a problem of low installation accuracy of the sensor solely relying on the setting of pressure and temperature. Contents of the invention [0003] The purpose of the embodiments of the present application is to provide an assembly device and system to solve the problem of low sensor installation accuracy in traditional settings that rely solely on pressure and temperature. [0004] In a first aspect, the embodiment provides an assembly device, the assembl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 魏新孙坤徐锋李泽峰
Owner 湃瑞电子科技(苏州)有限公司
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