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Dustproof structure, microphone packaging structure and electronic equipment

A dust-proof structure and packaging structure technology, applied in the direction of electrical components, electrostatic sensors, electrostatic transducer microphones, etc., can solve the problems of internal stress difference, omentum 103 folds, affecting the air flow of omentum 103, etc., to relieve stress poor effect

Pending Publication Date: 2020-05-08
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the existing isolation components, due to the differences in size, material, and structure between the support part 101 and the isolation mesh 102, a certain internal stress difference is likely to occur at the position where the two are connected, and

Method used

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  • Dustproof structure, microphone packaging structure and electronic equipment
  • Dustproof structure, microphone packaging structure and electronic equipment
  • Dustproof structure, microphone packaging structure and electronic equipment

Examples

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Example Embodiment

[0046] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0047] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0048] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0049] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a dustproof structure, a microphone packaging structure and electronic equipment. The dustproof structure comprises a carrier and a grid part, wherein the grid part comprises afilter screen and a fixing part arranged around the filter screen; the carrier is of a hollow structure, and a pore channel structure extending in the thickness direction of the carrier is arranged on the carrier; and the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with thecarrier. One technical effect of the dustproof structure is that the filter screen on the grid part can be kept in a flat state, and the grid part can effectively prevent external particles and foreign matters from entering the microphone packaging structure.

Description

technical field [0001] The invention relates to the technical field of electroacoustic conversion, and more specifically, the invention relates to a dustproof structure, a microphone packaging structure and electronic equipment. Background technique [0002] With the rapid development of electro-acoustic technology, various electro-acoustic products emerge in endlessly. As a transducer that converts sound into electrical signals, the microphone is one of the most important devices in electroacoustic products. Today, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, smart watches, and smart wearables. In recent years, for the package structure of the microphone, the design of its structure has become the focus and focus of research by those skilled in the art. [0003] The existing microphone packaging structure usually includes a housing with a cavity, and components such as chi...

Claims

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Application Information

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IPC IPC(8): H04R19/00H04R19/04
CPCH04R19/00H04R19/04
Inventor 游振江畠山庸平林育菁
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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