Power module and manufacturing method thereof

A technology of power modules and manufacturing methods, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as high process costs and reduced market competitiveness

Active Publication Date: 2022-04-08
DELTA ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the contrary, if the thickness of the metal layer is increased, the process cost will be higher, resulting in lower market competitiveness

Method used

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  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof

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Embodiment Construction

[0100] Some typical embodiments embodying the features and advantages of the present disclosure will be described in detail in the description in the following paragraphs. It should be understood that the disclosure is capable of various changes in different embodiments without departing from the scope of the disclosure, and that the description and drawings therein are illustrative in nature and not limiting. This disclosure.

[0101] figure 1 is a schematic diagram of the cross-sectional structure of the power module disclosing the first preferred embodiment of the present disclosure. In this embodiment, the power module 1 includes a carrier board 20 , a power device 30 , a plastic package 40 and a lead assembly 50 . The carrier board 20 includes a first surface 21 and a second surface 22 , wherein the first surface 21 and the second surface 22 of the carrier board 20 are opposite to each other, and the carrier board 20 further includes a conducting circuit 24 . The carri...

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Abstract

The present disclosure relates to a power module and a manufacturing method thereof. The power module includes a carrier board, a power device, a pin assembly and at least one plastic encapsulation component. The carrier board includes a first surface and a second surface, wherein the first surface and the second surface are opposite to each other, and the carrier board includes a conductive line. The power device is arranged on the carrier board, and the power device is electrically connected with the conductive line. The pin assembly is arranged on the carrier board, and includes a first horizontal part and a vertical part which are connected, and the vertical part is electrically connected with the conducting circuit of the carrier board. The pin assembly has a first contact surface and a second contact surface, and the first contact surface and the second contact surface are not coplanar. At least one plastic encapsulation component is disposed on the carrier board, at least partially covering the carrier board and at least partially enclosing the lead assembly, and the first contact surface and the second contact surface of the lead component are exposed to the plastic encapsulation component. The power module has a first surface and a first side surface, the first contact surface is located on the first surface of the power module, and the second contact surface is located on the first side surface of the power module.

Description

technical field [0001] The present disclosure relates to a power module, in particular to a power module with an optimized pin assembly structure and a manufacturing method thereof. Background technique [0002] A traditional power module, such as a DC / DC converter, usually includes power devices, magnetic components, capacitors, a carrier board, and pin terminals. The carrier board is used to carry power devices and interconnect the carrier boards of power devices, capacitors and magnetic components. Wherein, the outlet terminal included in the existing power module is a wave pin, which has the advantage of large flow capacity, but occupies a large area. In addition, in order to ensure the convenience of the manufacturing process, the height of the wave pin should be less than twice its length or width, and at the same time, a certain minimum length or width must be guaranteed to be no less than 1mm. However, these conditions are not conducive to reducing the size of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/492H01L23/48
CPCH01L23/3121H01L23/492H01L23/48
Inventor 洪守玉叶益青鲁凯陈庆东梁乐曾剑鸿
Owner DELTA ELECTRONICS (SHANGHAI) CO LTD
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