Method for packaging densely-arranged semiconductor chips for Internet of Things terminal

Abstract

The invention discloses a method for packaging densely-arranged semiconductor chips for an Internet of Things terminal and belongs to the semiconductor packaging field. The method for packaging densely-arranged semiconductor chips for the Internet of Things terminal is characterized in that a placement groove is formed in an upper surface of a lower shell, the upper surface of the lower shell is fixedly connected with two groups of conductive columns, the two groups of conductive columns are respectively positioned on two sides of the placement groove, a through hole is formed in the lower shell, the through hole is formed below the conductive columns, a pin is placed in the through hole, an upper end of the pin is fixedly connected with the conductive columns, adhesive is adhered to the bottom of the placement groove, a chip is placed in the placement groove, a lower end of the chip is bonded with the adhesive, and an upper surface of the chip is connected with the conductive columnsthrough a plurality of wires. The method is advantaged in that indirect connection between the chip and the pins can be realized, shaking or damage of the chip due to the fact that the pin drags the chip can be avoided, an elastic packaging mode is adopted during plastic packaging, so the fixing effect can be achieved, and the chip cannot be damaged.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, and more specifically, to a packaging method for densely arranging semiconductor chips used in Internet of Things terminals. Background technique [0002] Packaging technology is necessary and crucial for the chip, because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, the packaged chip is also more It is convenient for installation and transportation, because the packaging technology directly affects the performance of the chip itself and the design and manufacture of the PCB connected to it, so it is very important. [0003] At present, there are many ways to package semiconductor chips, but they are similar. Most of the connection methods between the chip and the pins are directly connected. Since the pins are extended to the outside of the package...

AI Technical Summary

Problems solved by technology

[0003] At present, there are many ways to package semiconductor chips, but they are similar. Most of the connection methods between the chip and the pins are directly connected. Since the pins are extended to the outside of the package, the pins will be accidentally pulled during installation or transportation. pins, it is easy to tear the chip inside the package, and the connection between the chip and the pin is also easy to be torn off. In addition, when the chip is finally plastic-packed, the plastic shell must press the chip. If the control is not good, it is easy to cause damage to the chip.

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