Display panel and display device

A display panel and display area technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of intrusion into evaporated film layers, etc., and achieve the effects of reducing package failure, improving reliability, and preventing deposition dead ends

Active Publication Date: 2020-04-10
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a display panel and a display device, which are used to solve the problem that water vapor or oxygen invades the evaporated film layer from the avoidance hole, and improve the reliability of the display panel

Method used

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  • Display panel and display device
  • Display panel and display device

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Embodiment Construction

[0039] Currently, if figure 1 as shown, figure 1 It is a schematic structural diagram of a display panel in the related art. The display panel with an aperture area for the display area A includes a display area A, an aperture area C, and a non-display area B between the display area A and the aperture area C. , the hole-digging process on the display panel will lead to the direct exposure of the luminescent functional film layer 01 evaporated on the entire surface, and the external water and oxygen will enter the luminescent functional film layer 01 in the non-display area B from the opening area C, and then along the oxidation The light-emitting functional film layer 01 enters the display area A inside the display panel, which eventually leads to failure of the display panel packaging.

[0040] Aiming at the problem that the display panel in the related art suffers from water vapor intrusion, the embodiments of the present invention provide a display panel and a display dev...

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PUM

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Abstract

The invention relates to the field of display, and discloses a display panel and a display device. The display panel comprises a substrate base plate; a thin film transistor array layer which comprises a first inorganic layer and a second inorganic layer, wherein the second inorganic layer is located at the side, away from the substrate, of the first inorganic layer; a partition groove which penetrates through the first inorganic layer and the second inorganic layer, wherein the orthographic projection of an opening of the surface, far away from the substrate, of the first inorganic layer on the substrate is covered by the orthographic projection of an opening of the surface, close to the substrate, of the second inorganic layer on the substrate, and the orthographic projection of an opening, located on the surface of the side, close to the substrate, of at least one inorganic layer of the thin film transistor array layer, on the substrate is larger than and covers the orthographic projection of an opening, located on the surface of the side, away from the substrate, of the inorganic layer, on the substrate; and a light-emitting functional film layer which is located at the side, away from the substrate, of the thin film transistor array layer, wherein a common layer in the light-emitting functional film layer is disconnected at the partition groove.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel and a display device. Background technique [0002] In the process of producing display panels, in order to prevent water vapor and oxygen from penetrating into the components and causing component failures, the display panels are subjected to Thin-Film Encapsulation (TFF). Thin-Film Encapsulation (TFF) uses one or more layers of inorganic Materials or inorganic / organic materials are superimposed to achieve water and oxygen resistance. [0003] In the prior art, in order to increase the screen-to-body ratio of the display device, holes are dug in the effective display area of ​​the display panel to provide avoidance holes for the camera. The hole-digging process will cause the side of the entire evaporated film layer to be directly exposed to the outside, and water vapor and oxygen will enter the oxide evaporated film layer from the hole-digging process,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32
CPCH10K59/12
Inventor 张国峰王俊强
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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