Solder paste temperature return time control system

Abstract

The invention discloses a solder paste temperature return time control system, which comprises box bodies having a protection effect. Each box body is provided with an opening. The system also comprises controllers arranged in the box bodies and playing a role in controlling the temperature return time, containing grooves formed in the box bodies, communicated with the openings and used for containing solder paste, clamping mechanisms arranged in the box bodies, communicated with the openings and connected with the controllers and used for clamping the solder paste, and sensors arranged in thecontaining grooves, connected with the controller and the clamping mechanisms and used for sensing storing and taking of the solder paste. The beneficial effects are that through arrangement of two box bodies, temperature returning of various or one type of solder paste is achieved at the same time, and the working efficiency is improved; and a timer is arranged in each containing groove and usedfor monitoring the temperature return time of the solder paste in the containing groove.

Description

technical field [0001] The invention relates to the technical field of solder paste temperature recovery, in particular to a control system for solder paste temperature recovery time. Background technique [0002] At present, there are strict requirements for the storage and use of solder paste, for example: the storage temperature should be controlled at a low temperature of 0-10°C; the solder paste is stored in a storage tank, and the storage period before opening is 6 months; And before unpacking, the temperature of the solder paste needs to be raised to the use environment (ie 25±2°C). The temperature return time is 2 or 4 hours according to the use situation, and it is forbidden to use other heaters to make the temperature rise instantly; while the current solder paste Access management depends entirely on manual control. This method is not only difficult to ensure the quality of solder paste, but also difficult to avoid the abuse or misuse of solder paste. In addition...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing solder paste temperature recovery time depends on manual control, which is prone to excessive or insufficient temperature recovery, and manual control is difficult to achieve the first-in-first-out use principle, and can only be used for one The solder paste is reheated, so a control system is designed to control the reheating time of the machine, specifically the solder paste reheating time control system

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