Magnetic field distribution homogenization device for magnetron sputtering process chamber

A process chamber and magnetic field distribution technology, which is applied in sputtering coating, metal material coating process, vacuum evaporation coating, etc., can solve the problem of uneven sputtering of the target

Active Publication Date: 2022-07-01
BEIJING INFORMATION SCI & TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with these methods, the motion trajectory of the magnetron still presents periodic regularity and radial distribution, and the sputtering in the middle of the target is relatively concentrated, and the sputtering of the target is still uneven.

Method used

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  • Magnetic field distribution homogenization device for magnetron sputtering process chamber
  • Magnetic field distribution homogenization device for magnetron sputtering process chamber
  • Magnetic field distribution homogenization device for magnetron sputtering process chamber

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Embodiment Construction

[0071] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.

[0072] Combine below Figure 1-13 The magnetic field distribution uniformization apparatus 100 for a magnetron sputtering process chamber according to an embodiment of the present invention will be described in detail. Wherein, the up-down direction is based on the up-down direction when the magnetron sputtering process chamber is normally placed.

[0073] like figure 1 and Figure 5 As shown, the magnetic field distribution homogenization device 100 for a magnetron sputtering process...

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Abstract

The invention discloses a magnetic field distribution homogenization device used in a magnetron sputtering process chamber. A set of magnets on the connecting rod of the flexible four-bar mechanism reciprocates relative to the frame of the flexible four-bar mechanism with different motion trajectories, and rotates with the link mechanism, thereby forming a non-radiative magnetic field distribution that varies aperiodically or weakly. According to the magnetic field distribution homogenization device of the present invention, the magnetic field distribution can be non-periodic or weak periodic, non-radial distribution, so that the uniformity of the magnetic field distribution can be improved, and the uniformity of the sputtering of the target material and the utilization of the target material can be improved Rate. The invention utilizes the curve characteristics of the connecting rod of the flexible four-bar mechanism and the cam mechanism to realize the uniform distribution of the magnetic field, thereby improving the uniformity of the flow field and the sputtering rate in the process chamber, and improving the controllability of the flow field.

Description

technical field [0001] The invention relates to a magnetic field distribution homogenization device used in a magnetron sputtering process chamber. Background technique [0002] In the manufacturing process of integrated circuit chips, such as integrated circuit CMOS, semiconductor elements, thin film transistors, etc., most of the device structure layers fabricated on the substrate are realized by deposition technology. Deposition refers to the process in which a material is deposited physically or chemically on the surface of a substrate to grow a thin film. The film thickness is on the nanometer scale, which is much smaller than other structure dimensions (eg wafer diameter of 6 inches, 18 inches). In a broad sense, deposition is an additive manufacturing process. The deposition techniques mainly include physical vapor deposition (PVD) and chemical vapor deposition (CVD). PVD uses methods such as evaporation or sputtering to turn solid materials into vapors, condense a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/34C23C14/35C23C14/54
CPCH01J37/3461H01J37/3455H01J37/3408C23C14/35C23C14/54
Inventor 侯悦民
Owner BEIJING INFORMATION SCI & TECH UNIV
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