Wafer cleaning device

Abstract

The invention discloses a wafer cleaning device, and the device comprises a wafer placing mechanism which is used for clamping the edge of a wafer and driving the wafer to rotate; a first spray head which is positioned on one side of the wafer placing mechanism and is used for upwards spraying a cleaning agent to the back surface of the wafer; and a cleaning brush and a guide rail which are located on one side of the wafer placing mechanism, wherein the cleaning brush is movably connected with the guide rail, and the cleaning brush can move relative to the guide rail and is used for cleaning the back of the wafer. When the wafer cleaning device is used for cleaning the back surface of the wafer, pollutants on the back surface of the wafer can be influenced by the shearing force of the cleaning brush and the gravity of the cleaning brush at the same time, so that the pollutants can be moved out of the back surface of the wafer more easily, and the cleaning effect is enhanced.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a wafer cleaning device. Background technique [0002] The improvement of the storage density of the memory device is closely related to the progress of the semiconductor manufacturing process. As the feature size of the semiconductor manufacturing process becomes smaller and smaller, the storage density of the memory device becomes higher and higher. In order to further increase storage density, memory devices with a three-dimensional structure (ie, 3D memory devices) have been developed. A 3D memory device includes a plurality of memory cells stacked in a vertical direction, which can double the integration level on a wafer per unit area and reduce the cost. [0003] The size of 3D memory devices is getting smaller and smaller, and the requirements for the accuracy of photolithography steps are getting higher and higher. In order to ensure the accuracy...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the wafer cleaning steps are very cumbersome. It is necessary to take out the wafer from the front opening unified pod (FOUP), turn the wafer over so that the back of the wafer faces upward, and put it into the first cleaning chamber. Clean the back of the wafer in the second cleaning chamber; then, take the wafer out, turn it over again so that the front of the wafer is facing up, put it into the second cleaning chamber, and clean the front of the wafer

Due to the cumbersome cleaning steps, the cleaning efficiency is very low, and when the wafer is turned over, it is easy to misuse, which makes the orientation of the wafer wrong, which affects the progress of the subsequent process

[0005] In addition, since the pollutants on the back of the wafer may adhere to the wafer, it is not easy to completely remove the pollutants, which will affect the focus of the subsequent photolithography process

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