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Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method

A technology for packaging structure and electronic devices, which is applied in the direction of electrical components, assembling printed circuits with electrical components, printed circuits, etc.

Active Publication Date: 2021-08-20
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, by increasing the gap between the upper surface of the substrate and the bottom of the electronic device by thickening the stencil, the amount of tin in the solder joint increases, and the risk of tin connection is more likely to occur

Method used

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  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method
  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method
  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method

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Embodiment Construction

[0063] In order to make the technical solutions of the embodiments of the present application clearer, the terms involved in the embodiments of the present application are explained first.

[0064] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic devices, and a carrier for electrical connections of electronic devices. Because it is made using electronic printing, it is called a "printed" circuit board.

[0065] PCBA (Printed Circuit Board+Assembly), the Chinese name is the finished circuit board, which assembles various electronic devices on the circuit board through the surface packaging process to form a finished circuit board.

[0066] SiP (System in Package) packaging is a commonly used method for miniaturization of packaging devices. SiP packaging is to preferentially assemble multiple active electronic components with different functions and optiona...

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Abstract

Embodiments of the present application provide a packaging structure, a finished circuit board, an electronic device, an electronic device, and a welding method. The packaging structure includes an electronic device and a substrate, and the electronic device and the substrate are electrically connected through solder joints formed by at least two layers of solder paste, wherein the materials of different layers of solder paste are different. The embodiment of the present application provides a packaging structure, which can increase the gap between the upper surface of the substrate and the bottom of the electronic device, effectively increase the filling amount of bottom gap filling glue or molding compound, and reduce the risk of tin connection between solder joints.

Description

technical field [0001] The embodiments of the present application relate to the field of electronic devices, and in particular to a packaging structure, a finished circuit board, an electronic device, an electronic device, and a welding method. Background technique [0002] As portable electronic products such as mobile phones and wearables become thinner and thinner and more functionally integrated, the energy consumption of electronic products is also increasing, so a large-capacity battery is required to improve battery life. In electronic products, in order to save space for placing large-capacity batteries, the components on the PCB are required to be miniaturized. SiP (System in Package) packaging is a common method for packaging device miniaturization. SiP packaging requires secondary plastic packaging to improve mechanical performance and environmental reliability. However, in some RF / WiFi SiP packages, some electronic devices with a size of 7mm×6mm or more are pac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/181H05K3/341H05K3/3485
Inventor 胡天麒佘勇史洪宾
Owner HUAWEI TECH CO LTD
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