Probe for improving flux spreading and method for manufacturing same

A manufacturing method and flux technology, applied in the field of probes for probe cards, can solve the problems of probe damage, affecting the separation of the probe and the position fixing arm, unable to realize the elasticity of the probe, etc., so as to prevent the diffusion and separation of the flux. smooth effect

Active Publication Date: 2022-05-10
GIGALANE CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At this time, since the sticky nature of the flux affects the separation of the probe and the position fixing arm, there is a problem that the probe is damaged when a force more than necessary is applied for separation.
[0007] In addition, if the flux remains and solidifies on the elastic portion of the probe, there is a problem that the elasticity of the probe cannot be achieved and the contact of the probe cannot be performed normally

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Probe for improving flux spreading and method for manufacturing same
  • Probe for improving flux spreading and method for manufacturing same
  • Probe for improving flux spreading and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The above objects, features and advantages can be further clarified by referring to the accompanying drawings and detailed descriptions below, so that those skilled in the art of the present invention can easily implement the technical idea of ​​the present invention. In addition, when it is judged that the detailed description of known technologies related to the present invention may unnecessarily obscure the gist of the present invention during the description of the present invention, the detailed description will be omitted.

[0048]And throughout the specification, when it is stated that a certain part is "connected" to another part, it includes not only the case of "direct connection", but also the case of "electrically connected" with other elements interposed therebetween. In addition, when a certain part "includes" or "has" a certain constituent element, unless there is a statement to the contrary, it means that other constituent elements may be included and po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to a probe for a probe card, and more specifically, to a probe for improving flux diffusion that prevents flux from diffusing along the probe when the probe is attached to an electrode of a space transformer, and its Manufacturing method. To this end, the present invention includes: a needle body portion; a needle elastic portion formed to elastically extend from the needle body portion; and a needle contact portion formed on the other side of the needle elastic portion, the needle elastic portion The body part further includes a flux preventing part formed in a groove shape for enclosing flux to prevent diffusion of flux along the needle body part.

Description

technical field [0001] The present invention relates to a probe for a probe card, and more specifically, to a probe for improving flux diffusion that prevents flux from diffusing along the probe when the probe is attached to an electrode of a space transformer, and its Production method. Background technique [0002] In general, a probe card is used to detect whether or not there is an abnormality in a wafer in a wafer process, which is a step before manufacturing a semiconductor package. [0003] Such a probe card includes a probe that is in contact with the wafer and receives a signal, a PCB that receives a signal from the probe and transmits the signal to a tester (tester), and a space transformer (spacetransformer) that transmits a signal between the probe and the PCB. ). [0004] Such probes are pasted on space transformers such as figure 1 As shown, in general, the position fixing arm 20 places the probe 10 coated with solder 5 (solder) on the electrode 30 of the sp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R3/00
CPCG01R1/067G01R1/073G01R3/00G01R1/06733G01R1/07378
Inventor 李在桓尹敏焕
Owner GIGALANE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap