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Heat dissipation assembly and electronic equipment

A technology of heat dissipation components and heat dissipation parts, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating modification, modification with liquid cooling, etc., which can solve the problems of low safety and reliability of electronic equipment and achieve improved safety Effects on Sex and Reliability

Active Publication Date: 2019-12-27
VIVO MOBILE COMM CO LTD
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Problems solved by technology

[0005] The invention discloses a cooling component and electronic equipment to solve the problem of low safety and reliability of the electronic equipment

Method used

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  • Heat dissipation assembly and electronic equipment
  • Heat dissipation assembly and electronic equipment
  • Heat dissipation assembly and electronic equipment

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Embodiment Construction

[0020] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] Such as Figure 1-Figure 3 As shown, the embodiment of the present invention discloses a heat dissipation assembly, which can be applied to electronic equipment, and specifically can inc...

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Abstract

The invention discloses a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises at least one component, a heat collection part, and a heat dissipation part, wherein the heat collection part is provided with a first inner cavity, the first inner cavity is filled with a heat conducting medium, the heat collection part is in contact with the component, the heat dissipation part makes contact with the heat collection part, the heat dissipation part is provided with a second inner cavity, the second inner cavity is filled with the heat dissipation medium, the heat dissipation medium is a phase change medium, and a capillary structure is arranged in the second inner cavity. The heat dissipation assembly is advantaged in that the heat of the component is gathered on the heat collection part, the heat gathered on the heat collection part is radiated out through the heat dissipation part, due to the fact that the heat of the components around the heat dissipation part is gathered on the heat collection part, flowing of the phase change medium in the heat dissipation part cannot be hindered, heat transfer circulation in the heat dissipation part is smoothly completed, and safety and reliability of the electronic equipment are improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation component and electronic equipment. Background technique [0002] The components of electronic equipment will generate heat when they work. If the heat cannot be radiated out in time, it will lead to heat accumulation, which may affect the normal use of corresponding functions and even damage the electronic equipment. [0003] The traditional heat dissipation method is mainly to attach a metal plate around the components, and the heat is radiated by the metal plate. However, with the advancement of technology and the development of electronic equipment, the functions of electronic equipment are becoming more and more diverse, which means that more components need to be integrated inside the electronic equipment, and the traditional heat dissipation method is no longer applicable. In view of this situation, a heat dissipation device filled with a phase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/2039
Inventor 徐波
Owner VIVO MOBILE COMM CO LTD
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