Branch coupler based on silicon through hole

Abstract

The invention discloses a branch coupler based on a silicon through hole. The branch coupler comprises a silicon substrate layer module, a top layer module and a bottom layer module. The top layer module is arranged on an upper surface of the silicon substrate layer module, and the bottom layer module is arranged on a lower surface of the silicon substrate layer module. The silicon substrate module comprises a grounding interconnection column and a signal interconnection column which penetrate through a silicon substrate. A grounding interconnection column dielectric layer is arranged on a side wall of a periphery of the grounding interconnection column, and a signal interconnection column dielectric layer is arranged on the side wall of the periphery of the signal interconnection column.Through using a vertical interconnection characteristic of TSV, two opposite 1 / 4 wavelength transmission line structures of the branch line coupler can be realized by using a vertical TSV interconnection line. And the other two opposite 1 / 4 wavelength transmission lines are realized by adopting a planar microstrip line so that an area of an component can be greatly reduced, an overall isolation degree of a circuit system can be effectively improved, and good compatibility with a three-dimensional micro-system process and structure can be realized.

Description

technical field [0001] The invention belongs to the field of three-dimensional integrated circuits, and in particular relates to a branch coupler based on through-silicon holes. Background technique [0002] Three-dimensional integrated circuit (Three-dimensional integrated circuit, 3-D IC) has the advantages of high packaging density, strong noise immunity, low power loss, fast working speed and easy heterogeneous integration, and can overcome many traditional planar integrated circuits. Physical, technological, and electrical constraints. In 3-D IC, a large number of homogeneous or heterogeneous chips are stacked, and through-silicon vias (ThroughSiliconVia, TSV) are used as vertical conductive channels between chips. TSV has become a key component affecting the overall performance of 3-D ICs. [0003] The branch line coupler mainly completes the function of power equalization in microwave and millimeter wave circuits. Tight couplers, especially 3dB couplers, are mainly...

AI Technical Summary

Problems solved by technology

The planar coupler of the traditional microstrip line not only occupies a huge chip area, but also has a small isolation between each branch, which is difficult to apply in the microwave and millimeter wave frequency bands

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