A Semi-coaxial Microstrip Combination RF Transmission Line Structure

Abstract

The invention discloses a semi-coaxial microstrip combined radio frequency transmission line structure, which belongs to the technical field of radio frequencies and microwaves, and includes semi-coaxial and matching microstrips. The semi-coaxial includes an outer conductor, a semi-circular dielectric and a semi-circular inner conductor, and the three form a unified installation contact surface; the matching microstrip includes a substrate on which a central conductive strip and a grounding metal layer are carried. In the working state, the semi-coaxial is pressed on the upper surface of the matching microstrip, and the center lines are aligned. Under the action of the upper and lower pressures, the semi-circular inner conductor and the central conduction band are attached to form a central conductor. The semi-coaxial outer conductor is On the upper ground layer, the electromagnetic wave is transmitted in TEM mode in the carrier composed of the semi-ring medium and the substrate. The invention is applied to the structural transition of the radio frequency connector from the coaxial to the microstrip line (strip line), and is especially suitable for the design of the horizontal crimping type radio frequency connector.

Description

technical field [0001] The invention belongs to the field of radio frequency microwave technology. Background technique [0002] In existing horizontally installed RF connectors, the coaxial line is directly transitioned to the microstrip line (strip line), and the interface adopts a single interface perpendicular to the transmission direction. Since the central conduction band of the microstrip line is thin copper, the structural strength is poor, and in order to reduce the influence of transmission mismatch on the electrical performance, the axis of the coaxial line should be as close as possible to the central conduction band of the microstrip line. The inner core of the shaft is protruded and appropriately reduced into a "probe", and then connected with the central guide belt. There are two specific implementations: [0003] 1) When connecting with the microstrip line, refer to the attached figure 1 , the "probe" is semicircular, the microstrip line 1 is inserted betw...

AI Technical Summary

Problems solved by technology

This paper presents an overall solution for coaxial-microstrip-coaxial connection, which has a narrow scope of application, and has many parts and high implementation cost.

In particular, the indium sheet is thin and weak, lacks positioning in the structure, and requires high assembly operations

[0005] The defects of the existing design are: 1) When soldering is used, the "probe" and the microstrip line are rigidly connected. "pin" breakage, the risk of peeling of solder joints or peeling of copper and substrate

2) The "probe" of the coaxial inner core protrudes separately and has been cut. As the operating frequency increases, the diameter of the "probe" becomes smaller, the structural strength is weakened, and it is easily damaged during assembly and disassembly

Patent (CN 206003942 U) Although the "probe" has not been cut, and the indium sheet is used as the transition from the "probe" to the microstrip, damage to the indium sheet cannot be avoided during disassembly

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