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Temperature sensor packaging structure and food processor adopting same

A technology of temperature sensor and packaging structure, applied in applications, kitchen utensils, household utensils, etc., can solve the problems of not being able to clean, not disassemble, and affecting the sensitivity of the temperature sensor, so as to ensure normal conduction, prolong the service life, and facilitate mutual The effect of contact

Pending Publication Date: 2019-10-18
中山市派优宜电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The first is to install the temperature sensor directly on the heating plate. This temperature sensor can directly detect the temperature of the food in the mixing cup. However, because the temperature of the heating plate is 200-300 degrees, and the maximum temperature of the food is about 100 degrees, this The temperature difference is very large, which seriously affects the sensitivity of the temperature sensor
However, the cooking machine is an integral structure, and the heating plate is fixedly connected with the stirring cup and cannot be disassembled, so the stirring cup cannot be soaked in water for cleaning, which has the disadvantage of inconvenient cleaning
[0004] The second is to install the temperature sensor on the cup lid. Since the heating plate is at the bottom of the mixing cup, the temperature of the food decreases from the bottom of the cup to the top. The temperature sensor on the cup lid can only detect the temperature at the top of the food. This method is not accurate enough to calculate the temperature at the bottom of the cup, and there are large errors. At the same time, in order to supply power to the temperature sensor, there are live parts in the handle of the stirring cup, so the stirring cup cannot be soaked in water for cleaning. Disadvantages of inconvenient cleaning
[0005] The third is to install the temperature sensor directly on the host, which only detects the temperature of the heating plate, and calculates the temperature of the food in the cooking cup through the temperature of the heating plate. This method also has errors

Method used

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  • Temperature sensor packaging structure and food processor adopting same
  • Temperature sensor packaging structure and food processor adopting same
  • Temperature sensor packaging structure and food processor adopting same

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Embodiment Construction

[0037] refer to Figure 1 to Figure 6 As shown, a temperature sensor packaging structure of the present invention includes a housing 1, the housing 1 is composed of a cylinder 1a open on one side and a sealing ring 1b formed at the sealing end of the cylinder 1a; inside the cylinder 1a A fixed frame 2 is provided, and a temperature sensing element 3 is interposed between the fixed frame 2 and the inner bottom of the cylinder 1a, and a conductive connector is provided on the fixed frame 2; the conductive connectors are respectively conductively connected to the temperature sensing element 3 and the external control panel. In this embodiment, the temperature sensing element is an NTC thermistor. Of course, other types of temperature sensing elements can be used to replace NTC thermistors as long as they can achieve the same temperature detection purpose.

[0038]Preferably, an external thread is formed on the outer wall of the cylinder 1a; a sealing sleeve 1c is integrally for...

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Abstract

The invention discloses a temperature sensor packaging structure and a food processor adopting the same, and belongs to the technical field of packaging structures. The packaging structure comprises ashell; the shell is composed of a cylinder body with a single-side opening and a sealing ring formed at the sealing end of the cylinder body; a fixed frame is arranged in the cylinder body; a temperature sensing element is clamped between the fixed frame and the bottom in the cylinder body; a conductive connecting piece is arranged on the fixed frame; the conductive connecting piece is conductively connected with the temperature sensing element and an external control panel; the food processor comprises a cutter holder; a first mounting through hole matched with the cylinder body is formed inthe cutter holder; the cylinder body is arranged in the first mounting through hole; a second mounting through hole corresponding to the first mounting through hole is formed in a heating disc; and an elastic conductive structure which is in contact with the conductive connecting piece is arranged in the second mounting through hole. The invention aims to provide the temperature sensor packagingstructure which is compact, accurate in temperature detection and easy to clean, and the food processor adopting the same; and the food processor is used for processing food materials.

Description

technical field [0001] The present invention relates to a temperature sensor structure, more specifically, to a temperature sensor packaging structure. The present invention also relates to the cooking machine adopting the structure. Background technique [0002] Currently popular household appliances with heating on the market all detect temperature indirectly, which has the disadvantage of low accuracy. Taking cooking machines as an example, there are three main temperature detection methods at present: [0003] The first is to install the temperature sensor directly on the heating plate. This temperature sensor can directly detect the temperature of the food in the blender cup. However, because the temperature of the heating plate is 200-300 degrees, and the temperature of the food is about 100 degrees, this The temperature difference is very large, which seriously affects the sensitivity of the temperature sensor. However, the cooking machine has an integral structure...

Claims

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Application Information

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IPC IPC(8): A47J43/07A47J43/046
CPCA47J43/0722A47J43/046
Inventor 丁明敏蒋茂江
Owner 中山市派优宜电器有限公司
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