Chip taut manual pick-up device

A chip and stretch frame technology is applied in the field of chip tensioning and manual picking devices, which can solve the problems of poor separation of chips and membranes, waste of edge chips, missing corners and raised tooling, etc., so as to reduce chip damage costs and solve the The effect of waste and improved yield

Active Publication Date: 2021-05-11
QINGDAO AEROSPACE SEMICON RES INST
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the waste of edge chips; if the chip spacing is too small, it is easy to cause scratches, edge collapse and missing corners when picked up with tweezers; the separation effect of the raised tooling chip and the film is not good; the position of the raised tooling microscope defect is judged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip taut manual pick-up device
  • Chip taut manual pick-up device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Such as Figure 1-2 , the device for manually picking up chips under tension in this embodiment is characterized in that it includes a lower base plate 2, a lower base plate support I1, a lower base plate support II3, a lever 4, a lever frame 5, a lever adjustment nut 6, a lever adjustment bolt 7, Upper fixed plate pillar 8, upper fixed plate 9, adjustable compression block 10, height adjustment bar 11, lower frame bottom plate 12, right-handed bracket I13, left-handed bracket I14, tensioning shaft I15, shaft support bracket I16, shaft support bracket II17, right-handed bracket I18, left-handed bracket I19, tension shaft II20, shaft support bracket III21, shaft support bracket IV22, oven lamp 23, oven lamp fixing plate 24, tension shaft nut I25, tension shaft nut II26, screw shaft 29. Height limit screw 30

[0026] The lower floor pillar I1 is installed on the lower end of the lower floor 2 and fixed by screws; the lower floor pillar II3 is installed on the lower floor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to a device and method for manually picking up chips under tension, which includes a device for manually picking up chips under tension, including a lower base plate, a lower base plate support I, a lower base plate support II, a lever, a lever frame, a lever adjustment nut, and a lever adjustment Bolt, upper fixing plate pillar, upper fixing plate, adjustable compression block, height adjustment bar, lower frame bottom plate, right-handed bracket I, left-handed bracket I, tensioning shaft I, shaft support bracket I, shaft support bracket II, right Rotary bracket I, left-handed bracket I, tensioning shaft II, shaft support bracket III, shaft support bracket IV, oven lamp, oven lamp fixing plate, tension shaft nut I, tension shaft nut II, screw shaft, and height-limiting screw ; The present invention is reasonable in design, compact in structure and easy to use.

Description

technical field [0001] The invention relates to a device and a method for manually picking up chips under tension. Background technique [0002] At present, manual chip picking is mainly to manually use tweezers, vacuum pen or other tools to clamp a very small single chip out of a densely arranged chip array. During the operation, the chip is stuck on a special mucous membrane, which can be passed through The method is degumming to reduce the adhesive force. Although the degumming is performed, the chip is still tightly attached to the film without gaps. It is difficult to pick up the chip with tweezers or other tools, which is easy to cause scratches, edge chipping, and missing corners. In order to reduce the above defects, the current operation methods are as follows: 1. Destroy the peripheral edge chip of the chip ring, and then use tweezers to pick up the chip from the damaged place, but the disadvantages of this operation are as follows: 1. Waste the edge chip; 2. If t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L21/68735Y02P70/10
Inventor 彭建学赵传洲王辉崔玲
Owner QINGDAO AEROSPACE SEMICON RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products