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Power-consumption-free heat dissipation device of electronic device

A technology of electronic devices and cooling devices, which is applied in the field of non-power consumption cooling devices for electronic devices, can solve the problems of complicated installation and disassembly, difficulty in meeting market demand, high price, etc., and achieve the effect of compact structure

Inactive Publication Date: 2019-09-20
GUANGZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, air-cooled radiators are the most common type of radiators for electronic devices, but traditional air-cooled radiators have disadvantages such as high noise, large volume, and high power consumption, which have relatively large limitations and are difficult to meet market demand.
The heat dissipation effect of the water-cooled radiator is relatively stable, but the overall price is high, and the installation and disassembly are complicated. When the usage rate of electronic devices is high, it is difficult for the liquid circulation to quickly remove a large amount of heat.

Method used

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  • Power-consumption-free heat dissipation device of electronic device
  • Power-consumption-free heat dissipation device of electronic device

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Embodiment Construction

[0018] refer to figure 1 and figure 2 , the present invention is a heat dissipation device for electronic devices without power consumption, which includes a body, and the body includes a casing 11 and a filling body 12 . The main body can be set as a cube, cuboid, triangular pyramid, spherical, cylindrical and other structures. As long as it has a certain space size and does not affect its normal operation, its shape can be set according to needs. Usually, the casing 11 is a thin-walled sealed structure, and a closed cavity for filling the filling body 12 is reserved inside. The casing 11 wraps the filling body 12, and the wrapping referred to here refers to a connection method in which the casing 11 isolates the filling body 12 and prevents it from being exposed. The material of the casing 11 is a solid thermally conductive material, that is, a solid material with relatively good thermal conductivity, such as metal, a non-metallic material with good thermal conductivity, ...

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Abstract

The invention discloses a power-consumption-free heat dissipation device of an electronic device. The power-consumption-free heat dissipation device comprises a body, wherein the body comprises a shell and a filling body. The shell wraps the filling body, the shell is made of a solid heat conduction material, and the filling body is made of a phase change material. A first air hole and a second air hole which are communicated are formed in the body, the first air hole transversely extends and forms an opening in the side face of the body, and the second air hole extends upwards and forms an opening in the upper end of the body. The power-consumption-free heat dissipation device is mounted on the electronic device. The phase-change process of the phase-change material and the first air hole and the second air hole are utilized to form a chimney effect, so that the heat dissipation of the electronic device can be conveniently and efficiently realized. The defect that a traditional radiator is subjected to high-power operation in a short time of an electronic device and generates a large amount of heat which cannot be discharged in time is overcome, so that a role in protecting the electronic device is played. Meanwhile, an external power supply does not need to be externally connected, and no noise is generated in the working process, and the heat dissipation device is compact in structure and is stable and durable. The heat dissipation device is used in the field of heat dissipation devices.

Description

technical field [0001] The invention relates to the field of heat dissipation devices, in particular to a heat dissipation device for electronic devices without power consumption. Background technique [0002] People widely use electronic equipment in daily life, but high-power electronic components such as the central processing unit of computers, north bridge chips, and graphics cards in electronic equipment will generate a lot of heat during operation. If the heat cannot be dissipated effectively, it will It directly causes the temperature of its electronic components to rise sharply, which seriously affects the normal operation of electronic components, and may even cause damage to electronic components. For this reason, it is necessary to install a cooling device in the electronic equipment to dissipate heat from these electronic components, so as to ensure the normal operation of the electronic equipment. Among them, the central processing unit (CPU) chip is the core ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20127H05K7/2029
Inventor 徐涛吴凤萍刘丽芳屈悦李敏琪吴会军周孝清张正国高学农
Owner GUANGZHOU UNIVERSITY
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