Power-consumption-free heat dissipation device of electronic device
A technology of electronic devices and cooling devices, which is applied in the field of non-power consumption cooling devices for electronic devices, can solve the problems of complicated installation and disassembly, difficulty in meeting market demand, high price, etc., and achieve the effect of compact structure
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[0018] refer to figure 1 and figure 2 , the present invention is a heat dissipation device for electronic devices without power consumption, which includes a body, and the body includes a casing 11 and a filling body 12 . The main body can be set as a cube, cuboid, triangular pyramid, spherical, cylindrical and other structures. As long as it has a certain space size and does not affect its normal operation, its shape can be set according to needs. Usually, the casing 11 is a thin-walled sealed structure, and a closed cavity for filling the filling body 12 is reserved inside. The casing 11 wraps the filling body 12, and the wrapping referred to here refers to a connection method in which the casing 11 isolates the filling body 12 and prevents it from being exposed. The material of the casing 11 is a solid thermally conductive material, that is, a solid material with relatively good thermal conductivity, such as metal, a non-metallic material with good thermal conductivity, ...
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