High-speed precise laser drilling platform and control method thereof

A laser drilling and precision technology, applied in laser welding equipment, manufacturing tools, welding equipment, etc., can solve the problems of small flexible hinge travel and difficult precise control, so as to ensure working performance, fatigue life, and eliminate design and manufacturing errors Effect

Active Publication Date: 2019-09-20
FOSHAN HUADAO SUPER PRECISION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing flexible hinges generally have a small stroke, only a few hundred microns
For large strokes, an amplification mechanism is required, which produces multi-modal superimposed responses at high speeds, making it difficult to achieve precise control

Method used

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  • High-speed precise laser drilling platform and control method thereof
  • High-speed precise laser drilling platform and control method thereof
  • High-speed precise laser drilling platform and control method thereof

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Embodiment Construction

[0033] The accompanying drawings are for illustrative purposes only, and should not be construed as limitations on this patent; in order to better illustrate this embodiment, certain components in the accompanying drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art It is understandable that some well-known structures and descriptions thereof may be omitted in the drawings. The positional relationship described in the drawings is for illustrative purposes only, and should not be construed as a limitation on this patent.

[0034] Such as figure 1 , 2 As shown, a high-speed precision laser drilling platform includes: a macro XY movement platform (1), a micro XY movement platform (2), and a working suction cup (3). Wherein the micro XY motion platform (2) is installed on the macro XY motion platform (1), and the micro XY motion platform (2) includes a base (202), an X-axis flexible hinge piece (203a), a...

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Abstract

The invention relates to a high-speed precise laser drilling platform and a control method thereof. The high-speed precise laser drilling platform comprises a macro XY motion platform, a micro XY motion platform and a working sucker, wherein the micro XY motion platform is arranged on the macro XY motion platform, the micro XY motion platform comprises a supporting base, a connecting frame, a micro-bearing platform, an X-axis flexible hinge piece and a Y-axis flexible hinge piece, the two ends of the X-axis flexible hinge piece are correspondingly fixed on the connecting frame and the supporting base, the two ends of the Y-axis flexible hinge piece are correspondingly fixed on the connecting frame and the micro-bearing platform, the micro-bearing platform is further provided with a micro X-axis encoder and a micro Y-axis encoder which are used for measuring the motion information of the micro-bearing platform in the X/Y direction respectively, and the working sucker is installed on the micro-bearing platform of the micro XY motion platform. According to the high-speed precise laser drilling platform and the control method thereof, high-speed interpolation is realized by means of elastic deformation of flexible hinges, and high-speed precise positioning among holes is realized.

Description

technical field [0001] The present invention relates to the technical field of laser drilling platforms, and more specifically, to a high-speed and precise laser drilling platform and a control method thereof. Background technique [0002] The motion platform of the existing laser microhole array processing equipment mainly adopts the mechanical guide rail type linear motor platform, which can only process 2-3 holes per second due to the influence of friction. Foreign countries use cross ball guide rail platforms, which have low friction and can reach 10 holes per second, but the price is expensive, and the efficiency is still far below the technological limit of hundreds of holes per second. The main movement of laser microhole array processing is high-speed precision positioning between hole centers + high-speed precision interpolation movement of microholes. If the interpolation movement adopts a frictionless flexible hinge mechanism, an interpolation frequency of tens o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/70
CPCB23K26/382B23K26/702
Inventor 杨志军白有盾彭皓苏丽云
Owner FOSHAN HUADAO SUPER PRECISION TECH CO LTD
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