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A kind of semiconductor wafer flattening equipment

A planarization and semiconductor technology, applied in the field of semiconductor wafer planarization equipment, can solve the problems of wafer waste and small semiconductor wafers, and achieve the effect of flattening transportation and avoiding mutual stacking

Active Publication Date: 2021-06-22
芜湖立德智兴半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the processing of semiconductor wafers, due to the small quality of semiconductor wafers, they will be stacked during transportation during processing, resulting in wafers being discarded due to stacking of wafers and being transported in for processing in later processing. Phenomenon

Method used

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  • A kind of semiconductor wafer flattening equipment
  • A kind of semiconductor wafer flattening equipment
  • A kind of semiconductor wafer flattening equipment

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Embodiment

[0024] see Figure 1-Figure 6 , the present invention provides a kind of semiconductor wafer flattening equipment, its structure comprises outer cover 1, flat device 2, base 3, processing table 4, described outer cover 1 is installed on the processing table 4, described processing table 4 and outer cover 1 mechanical Welding, the outer cover 1 is set up in a U-shaped structure, the flat device 2 is installed in the outer cover 1, and the processing table 4 is fixedly connected to the base 3;

[0025] The flat device 2 is composed of a central shaft 2a, a rotating disk 2b, a flat mechanism 2c, a connecting shaft 2d, and an outer layer connecting shaft 2e. The central shaft 2a is installed in the center of the rotating disk 2b, and the central shaft 2a runs through the rotating disk 2b. The turntable 2b is arranged in the outer layer connecting shaft 2e and fixedly connected with the outer layer connecting shaft 2e. There are five connecting shafts 2d. The connecting shaft 2d is...

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Abstract

The invention discloses semiconductor wafer flattening equipment, the structure of which comprises an outer cover, a flattening device, a base, and a processing table. The outer cover is installed on the processing table, and the processing table and the outer cover are mechanically welded. In the outer cover, the processing table is fixedly connected to the base. The beneficial effect of the present invention is that the rotating disk is driven by external mechanical force to drive the connecting shaft to rotate, so that the flat block moves away from the connecting shaft, and due to the centrifugal force generated by the rotation of the flat block, it slides outward to Drive the flat plate to flatten the semiconductor wafers, avoid stacking semiconductor wafers during processing and transportation, and realize flat transportation of semiconductor wafers.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a semiconductor wafer flattening device. Background technique [0002] After the semiconductor material is processed, it is manufactured into a semiconductor wafer. The processing of the semiconductor wafer needs to be processed one by one, and because the size of the semiconductor wafer is small, it is necessary to pay more attention to the processing of the semiconductor wafer. The current semiconductor wafer Circle planarization equipment has the following drawbacks: [0003] During the processing of semiconductor wafers, due to the small quality of semiconductor wafers, they will be stacked during transportation during processing, resulting in wafers being discarded due to stacking of wafers and being transported in for processing in later processing. Phenomenon. Contents of the invention [0004] Aiming at the deficiencies of the prior art, the present invention is realized...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092
Inventor 黄彬庆
Owner 芜湖立德智兴半导体有限公司
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