a box opening machine

A buffer mechanism and backplane technology, applied in the direction of opening closed containers, applications, liquid handling, etc., can solve problems such as pollution, increased chip production costs, door panel removal, etc., to simplify the unpacking steps, shorten the unpacking time, The effect of reducing the pressure difference

Active Publication Date: 2020-12-25
芯导精密(北京)设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional wafer box opener can only move the whole door panel of the wafer box horizontally and then vertically to open the wafer box for the manipulator to enter and pick up the wafers. Due to the strong force on the door panel, the traditional box opener cannot remove the door panel from the wafer box. If the opening force of the box opener is increased, it will cause greater vibration and noise pollution to the wafer box. Reduce the quality of the wafer
Others propose to use the release valve to inject part of the protective gas into the wafer box to balance the internal and external pressure before opening the door panel. Although the traditional box opening machine can be used to complete the box opening operation, it increases the process, prolongs the production time, and increases the cost. Chip Production Cost

Method used

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] It is to be understood that the terms "front", "rear", "left", "right", "upper", "lower", "top", "bottom", "inner", "outer" etc. indicate an orientation or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific o...

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Abstract

The invention discloses a box opening machine. The box opening machine comprises a back plate; an acquisition mechanism for fixing a door plate is arranged on the back plate; one side of the back plate is connected with a sliding rail frame through rotating pairs; the other side of the back plate is connected with the sliding rail frame through buffer mechanisms; and the sliding rail frame can move in the horizontal direction and the vertical direction respectively under the action of a horizontal driving mechanism and a vertical driving mechanism. The door plate can be opened more easily, thevibration of a wafer box is reduced, the box opening step is simplified, and the box opening time is shortened.

Description

technical field [0001] The invention relates to the technical field of equipment related to semiconductor manufacturing, in particular to a box opening machine. Background technique [0002] Wafers are the base material in the semiconductor manufacturing process. In semiconductor manufacturing plants, wafers are usually transported in sealed wafer boxes. With the increasing precision of modern manufacturing processes, it is necessary to evacuate the wafer box to meet the process requirements. The traditional wafer box opener can only move the whole door panel of the wafer box horizontally and then vertically to open the wafer box for the manipulator to enter and pick up the wafers. Due to the strong force on the door panel, the traditional box opener cannot remove the door panel from the wafer box. If the opening force of the box opener is increased, it will cause greater vibration and noise pollution to the wafer box. reduce the quality of the wafer. Others propose to us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B67B7/00H01L21/673
CPCB67B7/00H01L21/67393
Inventor 张庆钊陈百捷姚广军王镇清
Owner 芯导精密(北京)设备有限公司
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