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Display panel and manufacturing method thereof

A display panel and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of poor full-screen packaging effect, etc., and achieve the effect of improving display effect and packaging reliability

Active Publication Date: 2019-08-30
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a display panel and a manufacturing method thereof, so as to solve the problem of poor encapsulation effect of the existing full screen

Method used

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  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described through implementation with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are the embodiment of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] refer to figure 1 Shown is a schematic diagram of an existing full-screen display panel. The full-screen display panel is provided with a circular hole area 1, and the surrounding of the circular hole area 1 is a display area 2, and the circular hole area 1 is used to place photosensitive functional components, so as to increase the screen-to-bod...

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Abstract

The embodiment of the invention discloses a display panel and a manufacturing method thereof. The display device comprises a first substrate, a hollow area, a first non-display area, a display area and a second non-display area surrounding the display area; an array layer and a light-emitting device layer are stacked on the first substrate in order, the array layer comprises an array metal layer and an insulating layer which are arranged at intervals, the light-emitting device layer comprises a first electrode layer, a pixel defining layer, an organic layer and a second electrode layer which are sequentially arranged in a stacking mode, at least part of the insulating layer and the pixel defining layer are arranged in the first non-display area in a contact mode, the pixel defining layer comprises at least one first groove, at least part of the insulating layer comprises at least one second groove, the first groove and the second groove are located in the first non-display area, the first groove and the second groove are at least partially overlapped in an orthographic projection perpendicular to a plane where the first substrate is located, and the first groove and the second groove are arranged in a contact mode to form a groove structure. The embodiment of the invention improves the packaging reliability.

Description

technical field [0001] Embodiments of the present invention relate to display technologies, and in particular to a display panel and a manufacturing method thereof. Background technique [0002] At present, the full screen almost occupies a large proportion of the consumer product market, and the full screen on the market is essentially a display with a very high screen ratio. Therefore, how to further increase the screen ratio of the full screen has become the current display. A popular development direction of the screen. Based on this, the full screen punching technology (including actual digging and transparent blind hole technology) came into being. The full screen with punching design can not only meet the high screen ratio, but also cooperate well with accessories such as cameras. . [0003] The display screen adopts a perforated design, and functional devices such as a camera can be placed at the perforated position. Using this full-screen technology can achieve a ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/50H01L51/52H01L51/56
CPCH10K59/121H10K59/122H10K50/11H10K50/805H10K59/1201H10K71/00
Inventor 张赛朱家柱陈英杰
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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