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Display back plate and preparation method thereof, and display device

A technology for display backplanes and substrate substrates, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electrical components, etc., and can solve the problems of sub-pixel cross-color, OLED related technologies need to be improved, and sub-pixels do not emit light.

Active Publication Date: 2019-08-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the inkjet printing process, due to process conditions, equipment fluctuations and other conditions, the ink in the sub-pixel is prone to overflow, resulting in cross-coloring of adjacent sub-pixels, and causing one sub-pixel to emit color to the other adjacent sub-pixel. The color light of the sub-pixel, or the sub-pixel does not emit light, which seriously affects the quality of the display screen
[0003] Therefore, OLED-related technologies still need to be improved

Method used

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  • Display back plate and preparation method thereof, and display device
  • Display back plate and preparation method thereof, and display device
  • Display back plate and preparation method thereof, and display device

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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification. The reagents or instruments used were not indicated by the manufacturer, and they were all commercially available conventional products.

[0029] In one aspect of the invention, the invention provides a display backplane. According to an embodiment of the present invention, refer to figure 1 , the display backplane includes a base substrate 10, a pixel defining layer 20 disposed on the base substrate 10, the pixel defining layer 20 defines a plurality of sub-pixel openings 21, and the pixel defining layer 20 is far away from the substrate ...

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PUM

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Abstract

The invention provides a display back plate and a preparation method thereof, and a display device. The display back plate comprises a substrate and a pixel defining layer arranged on the substrate, wherein the pixel defining layer defines a plurality of sub-pixel openings; and the surface, far away from the substrate, of the pixel defining layer is provided with overflow grooves which are locatedbetween the adjacent sub-pixel openings. Therefore, when a light emitting layer is formed through ink-jet printing, the ink overflowing from the sub-pixel openings can flow into the overflow groovesso as to effectively avoid color mixing between adjacent sub-pixels, obviously improve the process defect and improve the processing yield, and the distance between each two adjacent sub-pixel openings is decreased so as to improve the resolution and display quality.

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to a display backplane, a preparation method thereof, and a display device. Background technique [0002] Inkjet printing technology is one of the main development directions of OLED technology because it can significantly improve the equipment and material costs of the OLED process. During the inkjet printing process, due to process conditions, equipment fluctuations and other conditions, the ink in the sub-pixel is prone to overflow, resulting in cross-coloring of adjacent sub-pixels, and causing one sub-pixel to emit color to the other adjacent sub-pixel. The color light of the sub-pixel, or the sub-pixel does not emit light, seriously affects the quality of the display screen. [0003] Therefore, current OLED-related technologies still need to be improved. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/56H10K99/00
CPCH10K59/122H10K71/135H10K71/00H10K71/191H10K2102/351
Inventor 高昕伟臧丹丹李朋陈琦鹤廖金龙
Owner BOE TECH GRP CO LTD
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