Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Chip temperature detection circuit and audio power amplifier

A technology of temperature detection circuit and operational amplifier, which is applied to thermometers, measuring electricity, and measuring electrical variables. It can solve the problems of large speaker current detection value and large metal resistance voltage drop, so as to improve accuracy and eliminate the impact of offset voltage. The effect of temperature on sampling voltage influence

Inactive Publication Date: 2019-07-30
SHANGHAI AWINIC TECH CO LTD
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the large temperature coefficient of the metal resistor, as the temperature of the chip rises, the resistance value of the metal resistor will increase, and the voltage drop on the metal resistor will also increase, causing the current detection value of the speaker to be biased. Big

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip temperature detection circuit and audio power amplifier
  • Chip temperature detection circuit and audio power amplifier
  • Chip temperature detection circuit and audio power amplifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] The above is the core idea of ​​the present invention. In order to make the above objects, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Description, it is obvious that the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0058] The embodiment of the present invention provides a chip temperature detection circuit, such as figure 1 As shown, it includes a temperature sampling unit 10 , a first control unit 11 , a first buffer unit 12 , a second buffer unit 13 , a second control unit 14...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip temperature detection circuit and an audio power amplifier. The chip temperature detection circuit comprises a temperature sampling unit, a first control unit, a first buffer unit, a second buffer unit, a second control unit and a comparison and amplification unit. Through the temperature sampling unit, the buffer units and the comparison and amplification unit, temperature sampling voltage can be obtained so that the temperatures of chips can be obtained according to the temperature sampling voltage, thereby eliminating the influences, on current detection of loudspeakers, of temperature changes; and through the first and second control units which are alternately operated under a first state and a second state, the influences, on the temperature sampling voltage, of offset voltage generated by process deviations of the buffer units are eliminated, so that the correctness of chip temperature detection results is improved.

Description

technical field [0001] The invention relates to the technical field of digital audio power amplifiers, and more particularly, to a chip temperature detection circuit and an audio power amplifier. Background technique [0002] The reliability of speakers is getting more and more attention in the field of consumer electronics, especially in the application of mobile terminals such as mobile phones. During the working process of the speaker, it is necessary to transmit the impedance data of the speaker to the processor in real time, so that the processor can control the amplitude of the music according to the change of impedance, so that the speaker works within a reliable range and plays the role of protecting the speaker. [0003] The impedance of the speaker is obtained by sensing the voltage and current at the output stage of the Class D audio power amplifier and dividing the voltage by the current. In the application of class D audio power amplifier, the common current de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/01G01R31/28G01R19/32
CPCG01K7/01G01R19/32G01R31/2874
Inventor 周佳宁张海军杜黎明孙洪军
Owner SHANGHAI AWINIC TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products