Flip LED chip and making method thereof

Abstract

The invention discloses a flip LED chip, which comprises a substrate, a light-emitting structure arranged on the surface of the substrate, a light-emitting film layer disposed on the back surface of the substrate, and phosphor and a packaging glue arranged on the light-emitting film layer, wherein the refractive index of the packaging glue is smaller than that of the light-emitting film layer, therefractive index of the light-emitting film layer is smaller than that of the substrate, the light transmittance of the light-emitting film layer is greater than 90%, and multiple holes are arrangedin the light-emitting film layer. Correspondingly, the invention also provides a flip LED chip making method. Through mutual match among the substrate, the light-emitting film layer and the packagingglue, by using different light refractive indexes and the holes in the light-emitting film layer, total reflection of the substrate is reduced, more light is induced to the light-emitting film layer,and besides, the holes in the light-emitting film layer can allow more light to overflow from the light-emitting film layer, the light-emitting efficiency of the chip is increased, and the chip brightness is improved.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to a flip-chip LED chip and a manufacturing method thereof. Background technique [0002] Light-emitting diodes (Light-Emitting Diodes, LEDs) are widely used in related fields such as displays, automotive lighting, and general lighting backlights due to their characteristics of energy saving, environmental protection, safety and durability, high photoelectric conversion rate, and strong controllability. [0003] Flip-chip LED chip is a new type of LED chip in recent years. Its main function is that there is no packaging process, which greatly saves production efficiency. It can be applied to high current and can realize ultra-miniature LED chips. [0004] The light emitted by the flip-chip LED chip needs to be reflected by the reflective layer and then emitted through the substrate. In terms of luminous efficiency, due to the relationship between secondary optical refl...

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Problems solved by technology

[0004] The light emitted by the flip-chip LED chip needs to be reflected by the reflective layer and then emitted through the substrate. In terms of luminous efficiency, due to the relationship between secondary optical reflection, the light output efficiency is low; in addition, because the phosphor powder and packaging glue are coated on the substrate In general, it is easy to cause the problem of blue leakage on the side of the flip-chip LED chip, and the problem of impurity in light chromaticity

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