Foreline for vacuum pump, vacuum system and semiconductor manufacturing equipment

A front-stage pipeline and manufacturing equipment technology, which is applied in semiconductor/solid-state device manufacturing, components of elastic fluid pumping devices, mechanical equipment, etc., can solve the problem of reducing machine running time, increasing economic costs, and affecting production efficiency. and other problems, to achieve the effect of increasing the running time, reducing the production cost and improving the production efficiency

Inactive Publication Date: 2019-06-11
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when a dry vacuum pump is used to generate a vacuum environment, if the extracted gas contains dust and other debris, the debris will enter the pump body together with the air flow and easily cause the pump to be stuck, resulting in short-term vacuum failure and vacuum backfilling. Happening
If things go on like this, it will not only seriously affect the production efficiency and reduce the running time of the machine, but also cause a substantial increase in economic costs due to frequent replacement of cavity parts and multiple inspections

Method used

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  • Foreline for vacuum pump, vacuum system and semiconductor manufacturing equipment
  • Foreline for vacuum pump, vacuum system and semiconductor manufacturing equipment
  • Foreline for vacuum pump, vacuum system and semiconductor manufacturing equipment

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Embodiment Construction

[0059] In order to make the purpose, advantages and features of the present invention clearer, various embodiments of a backing pipeline for a vacuum pump and a vacuum system proposed by the present invention will be further described in detail below with reference to the accompanying drawings. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0060] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally used in its sense including "and / or", unless the content clearly indicates otherwise, and the terms "installed", "connected" 2. "Connection" should be understood in a broad sense, for example, it can be a fixed connecti...

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PUM

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Abstract

The invention discloses a foreline for a vacuum pump, a vacuum system and semiconductor manufacturing equipment. The foreline comprises a main pipe, a receiver and a branch pipe. The main pipe is vertically mounted. The receiver is arranged at the bottom of the main pipe and provided with an opening, and the opening and the bottom of the main pipe are in sealed connection. The branch pipe is a non-linear pipeline, one end of the branch pipe is connected with the main pipe, and the other end of the branch pipe is connected with the vacuum pump. Airflow is used for sequentially passing through the main pipe and the branch pipe to enter the vacuum pump, meanwhile the receiver is used for receiving matter falling when the airflow passes through the main pipe through the opening. The foreline has the beneficial effects that dust of the airflow carrying a large quantity of dust impurities is filtered out in the foreline, then the airflow enters the vacuum pump, the dust entering a pump bodyis reduced, the possibility of the holddown phenomenon is reduced, the continuous operation time of the vacuum pump is prolonged, the capacity is improved, and the economic cost is reduced.

Description

technical field [0001] The invention relates to the technical field of vacuum pipelines, in particular to a front-stage pipeline for a vacuum pump, a vacuum system and semiconductor manufacturing equipment. Background technique [0002] Dry vacuum pumps are widely used in many aspects because they do not use fluids such as oil, water or polymers as working media and avoid backflow. In recent years, dry vacuum pumps have developed rapidly, and their main driving forces come from the semiconductor industry, chemical industry and thin film industry. At present, the semiconductor industry has adopted a large number of dry vacuum pumps instead of oil-sealed mechanical pumps, which has greatly improved the performance and quality of products. [0003] However, when a dry vacuum pump is used to generate a vacuum environment, if the extracted gas contains dust and other debris, the debris will enter the pump body together with the air flow and easily cause the pump to be stuck, res...

Claims

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Application Information

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IPC IPC(8): F04C29/12F04C25/02F04C27/00H01L21/67C23C16/44
Inventor 顾颖豪缪敏敏
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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