A multi-layer embedded computer protection case

Abstract

The invention discloses a multilayer embedded computer protection case. The case comprises a protective outer box body, an accommodating groove and a heat conducting device, a micro water pump is mounted on the protective outer box body; a first water tank is reserved in the protective outer box body; the heat dissipation fan blades are installed on the inner side of the installation ring, the connecting inserting grooves are reserved in the heat dissipation fan blades, a driving device is installed at the right ends of the heat dissipation fan blades, the driving device is installed on the right side of the protection outer box body, a motor is arranged above the driving device, and the motor is connected with the driving device through a transmission belt. The multilayer embedded computer protection case adopts a heat dissipation mode of combining air cooling and water cooling, the heat dissipation mode is high in efficiency, and the temperature generated when the mainboard, the CPUand the display card work can be taken away in time, so that the mainboard, the CPU and the display card work at a lower temperature, the high heat condition of the mainboard, the CPU and the displaycard is avoided, and the computer is prevented from easily generating working faults.

Description

Technical field [0001] The present invention relates to the field of computer technology, in particular to a multi-layer embedded computer protection case. Background technique [0002] Computers are divided into desktop computers and portable computers (i.e. notebook computers). Desktop computers are usually equipped with larger mainframes, which are equipped with important working parts such as motherboards, CPUs and graphics cards. Therefore, it is usually necessary to use a case to protect the computer mainframe. , To avoid man-made damage to internal parts and high temperature damage during work; [0003] 1. Most of the existing chassis adopt air-cooled heat dissipation. This kind of heat dissipation efficiency is low and cannot take away the temperature generated by the motherboard, CPU and graphics card in time, which makes the motherboard, CPU and graphics card vulnerable to high temperature damage, which makes the computer easy to appear Work failure [0004] 2. Most of th...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-layer embedded computer protection case to solve the problem that most of the existing cases proposed in the above background technology adopt air-cooled heat dissipation, which has low heat dissipation efficiency and cannot take away the motherboard, CPU and graphics card in time. The temperature generated by the time, so that the motherboard, CPU and graphics card are vulnerable to high temperature damage, and the computer is prone to work failures. After the chassis is shaken, it will be transmitted to the motherboard very quickly. The parts are loose, which is not conducive to the stable operation of the computer

Images