Vibration device applied to test processor

Abstract

The invention relates to a vibration device applied to a test processor. Specifically, according to an embodiment of the present invention, the vibrating device applied to the test processor may include: a conveyor belt, used to transport the tray in one direction; rollers, arranged on both sides of the conveyor belt, and the The conveyor belt cooperates and rotates; the belt support part is arranged between the rollers located on both sides of the conveyor belt, and supports the conveyor belt so that the tray and the conveyor belt are close to each other; the anti-separation part is used to prevent the tray from detaching from the conveyer belt; and a vibration excitation unit that applies vibration to at least one of the belt support portion and the detachment preventing portion.

Description

technical field [0001] The invention relates to a vibration device applied to a test processor. Background technique [0002] In order to test electronic components (especially semiconductor elements), a tester (TESTER) for testing electrically connected electronic components and a device for electrically connecting electronic components to the tester, that is, a test handler (TESTHANDLER) are required. [0003] The test handler uses a test tray (TEST TRAY) that can be transported at one time in a state where a plurality of semiconductor elements are loaded in a matrix in order to increase the processing capacity. [0004] Since the semiconductor element is electrically connected to the test socket (TEST SOCKET) of the tester when it is loaded on the test tray (also called the carrier board), the distance between the semiconductor elements loaded on the test tray needs to be Corresponds to the interval between test sockets of the tester. [0005] On the other hand, the sem...

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Problems solved by technology

[0014] The customer tray CT2 whose loading of semiconductor components has been completed will be moved to the stacker (installed at the storage place of the customer tray CT2 of the test processor) and stacked for storage. In the above case, cracks (cracks) may appear on the semiconductor element out of the bag, or the terminal (BGA type Ball in BGA type) located at the lower part of the semiconductor element may be damaged

[0015] In addition, since user trays may not be continuously stacked horizontally on top, when the stacked user trays are taken out from the unloading stacker, the user trays cannot be transported correctly, and semiconductor components in the user trays may be lost. Questions where the likelihood will increase

[0016] In addition, the present applicant attempts to return the semiconductor element in the disengaged state to the bag by installing four or six vibration motors, and utilizing the excitation force of the vibration motors, but, with the use of a larger number (for example: six ) motors, the management of vibration motors becomes complicated, and the weight increases excessively due to multiple vibration motors.

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