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Preparation device of copper-clad plate and colloidal copper foil applied to preparation of copper-clad plate

A technology for a copper clad laminate and a preparation device is applied in the field of colloidal copper foil, which can solve the problems of low aging resistance, inability to greatly improve performance, poor high temperature and low temperature resistance, etc., and achieve the effect of preventing displacement.

Active Publication Date: 2019-04-09
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the preparation process of copper clad board, the insulating material and colloidal copper foil are directly compounded, but a slight deviation in the compounding process will easily cause the position of the insulating material and colloidal copper foil to shift, which will cause local bulges and incomplete coverage, which will affect the copper clad. The quality of the foil board, at the same time, the joints of the two sides of the laminated copper clad board are easy to peel off
[0003] Glue-coated copper foil is widely used in the preparation of copper-clad boards. The adhesives used in existing glue-coated copper foils are usually phenolic resin and epoxy resin adhesives, but the existing epoxy resin adhesives The aging resistance of the adhesive is low, and the performance of high temperature and low temperature resistance is poor, while the existing anti-aging agent and reinforcing agent are directly added to the adhesive. Due to the poor compatibility of the adhesive itself, after adding the auxiliary agent Performance cannot be improved much

Method used

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  • Preparation device of copper-clad plate and colloidal copper foil applied to preparation of copper-clad plate
  • Preparation device of copper-clad plate and colloidal copper foil applied to preparation of copper-clad plate
  • Preparation device of copper-clad plate and colloidal copper foil applied to preparation of copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A preparation device for a copper clad board, through which the adhesive surface of the colloidal copper foil is pressed against the glass cloth to obtain a copper clad board, such as figure 1 , figure 2 , image 3 , Figure 4 As shown, the device includes a frame 1, and two oppositely arranged first support plates 11 are installed on one side of the surface of the frame 1, and a position adjustment mechanism 2 is installed and fixed between the two first support plates 11, while the frame 1, two opposite second support plates 12 are vertically installed and fixed on both sides of the middle part of the surface, a first top plate 121 is vertically connected and fixed between the tops of the two second support plates 12, and a bottom plate is vertically connected and fixed between the bottom ends of the two second support plates 12 122, the first adjustment screw 3 is installed on the first top plate 121, and the pressing mechanism 4 is installed and fixed between the...

Embodiment 2

[0047] Applied to the preparation of glue-coated copper foil for copper-clad boards, including electrolytic copper foil layer, the matte surface of electrolytic copper foil layer is coated with a layer of composite adhesive;

[0048] Wherein the specific preparation process of the composite binder is as follows:

[0049] In the first step, add 1kg of bisphenol A into N,N-dimethylformamide, stir and mix evenly, and then add 917g of 4-trifluoromethylbenzoyl chloride and 725g of p-cyanobenzoyl chloride to the reaction vessel. Stir the reaction for 10 hours, then evaporate and crystallize, wash with hot water at 50°C, and dry to obtain product A with a yield of 98.8%; introduce 4-trifluoromethylbenzoyl chloride into the reaction monomer through the acylation reaction of phenol and p-cyanobenzoyl chloride;

[0050] In the second step, add 1 kg of the product A prepared in the first step to nitrobenzene, heat up to 165 ° C, add 1.23 kg of anhydrous aluminum chloride to the reaction...

Embodiment 3

[0054] The specific preparation process of the composite binder is as follows:

[0055] In the first step, add 1kg of bisphenol A into N,N-dimethylformamide, stir and mix evenly, then add 1.45kg of p-cyanobenzoyl chloride into the reaction vessel, stir and react at room temperature for 10h, then evaporate and crystallize with After washing with hot water at 50°C, drying to obtain product A with a yield of 95.6%;

[0056] In the second step, add 1 kg of the product A prepared in the first step to nitrobenzene, heat up to 165 ° C, add 1.23 kg of anhydrous aluminum chloride to the reaction vessel, and react under constant temperature reflux for 20 hours, and then cool the reaction product to room temperature. Pour into a dilute hydrochloric acid solution with pH=1, filter after the solid precipitates out, and then wash and dry with ethanol to obtain product B with a yield of 93.1%;

[0057] In the third step, 1 kg of product B is added to 360 g of epichlorohydrin, and after the ...

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Abstract

The invention discloses a preparation device of a copper-clad plate. The preparation device comprises a rack, wherein two first supporting plates which are oppositely arranged are arranged on one sideof the surface of the rack; a position adjustment mechanism is fixed between the two first supporting plates; two second supporting plates which are oppositely arranged are vertically fixed on two sides of the middle of the surface of the rack; a first top plate is vertically connected and fixed between top ends of the two second supporting plates, and a bottom plate is vertically connected and fixed between bottom ends of the two second supporting plates; a first adjusting screw is arranged on the first top plate; and a laminating mechanism is fixed between the two supporting plates in a sliding manner. According to the preparation device of a copper-clad plate, a colloidal copper foil and an insulating material glass cloth are subjected to position adjustment before laminating by virtueof the position adjustment mechanism, so that problem that the quality of a copper-clad plate is influenced by bubbles and incomplete coverage since the position of a colloidal copper foil and glasscloth are displaced in the laminating process can be solved.

Description

technical field [0001] The invention belongs to the field of copper foil preparation, and relates to a preparation device for a copper-clad board and colloidal copper foil used for preparing the copper-clad board. Background technique [0002] During the preparation process of copper clad board, the insulating material and colloidal copper foil are directly compounded, but a slight deviation in the compounding process will easily cause the position of the insulating material and colloidal copper foil to shift, which will cause local bulges and incomplete coverage, which will affect the copper clad. The quality of the foil board, at the same time, the joints of the two sides of the laminated copper clad board are easy to peel off. [0003] Glue-coated copper foil is widely used in the preparation of copper-clad boards. The adhesives used in existing glue-coated copper foils are usually phenolic resin and epoxy resin adhesives, but the existing epoxy resin adhesives The aging...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/12B32B38/18C09J163/00H05K3/02
CPCC08G59/28C08G59/308C09J163/00
Inventor 叶敬敏王俊锋温丙台郑衍年刘焕添郭志航叶冬萌
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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