Feeding system applicable to super-large scale atomic layer deposition

Abstract

The invention discloses a feeding system applicable to super-large scale atomic layer deposition. The system comprises a silicon carrier and a first end cover flange and a second end cover flange which clamp the silicon carrier; the first end cover flange and the second end cover flange are connected into a whole through multiple shafts vertically penetrating through the first end cover flange andthe second end cover flange, and one ends of the shafts penetrate through the first end cover flange and are connected with the second end cover flange; the other ends of the shafts stretch out of the first end cover flange, a spring sleeves an extension part, shaft caps are arranged at the ends of protruding ends, and springs are limited at the protruding ends of the shafts. Accordingly, the silicon carrier serves as one part of an inner cavity, the deal load is greatly reduced, and transfer is light; meanwhile, the feeding system is heated directly, the heating rate can be obviously increased, the heating time is shortened, and the heat utilization rate is high.

Description

Technical field [0001] The present invention belongs to the field of semiconductor manufacturing, and specifically relates to the field of photovoltaic cell manufacturing. The atomic layer deposition (ALD) technology is applied to the photovoltaic field to produce equipment for ultra-large-scale products. Background technique [0002] With the scale of the photovoltaic industry and the rapid development of photovoltaic technology, ALD technology, that is, atomic layer deposition technology, has become an effective way to reduce costs and increase efficiency of photovoltaic products. The atomic layer deposition technology is to expose the product to two or more precursor gases for coating. The usual ALD equipment separates the coating chamber into a material chamber (inner chamber) and a vacuum chamber (outer chamber). The material chamber can be separated from the main equipment for loading. After the product is loaded, the material chamber can be transported to the vacuum chambe...

AI Technical Summary

Problems solved by technology

This structure has the following disadvantages: the weight of the material chamber is very large, which is not conducive to transshipment; the large mass and heat capacity are also large, which is not conducive to heat utilization and increases the heating time of the product; it is inconvenient to load and unload the material at the top; Loading and unloading; there is no uniform flow device in the air intake, which is easy to generate dust

Images