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A scalable processing board based on high-speed and high-density connectors

A high-density connector and extended processing technology, applied in the field of scalable processing boards, can solve problems such as lack of extrusion resistance, easy damage, and easy heating of processing boards, so as to reduce development costs, increase use time, and shorten development cycles. Effect

Active Publication Date: 2020-11-10
重庆秦嵩科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an expandable processing board based on high-speed and high-density connectors, which can solve the problem that most of the existing processing boards do not have expandable functions, resulting in most processing boards being unable to meet different use environments. In the case of high environmental conditions, the processing board cannot be connected with more chips and processors, so that the processing board cannot meet the use requirements. The anti-vibration performance of the processing board is relatively average, and it cannot better cope with the environment with better vibration requirements. , the processing board tends to generate heat when it is working. Ordinary heat sinks cannot meet the heat dissipation requirements of the processing board. Long-term use will affect the working efficiency and power consumption of the processing board. When the processing board is installed in a compact environment, it is not durable Due to the extrusion function, the processing board cannot meet the installation requirements, and it is prone to damage after installation.

Method used

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  • A scalable processing board based on high-speed and high-density connectors
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  • A scalable processing board based on high-speed and high-density connectors

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Embodiment Construction

[0036] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] see Figure 1-8 As shown, a scalable processing board based on a high-speed high-density connector includes a sub-board 1 and a carrier board 11, and the upper surface of the sub-board 1 is equipped with a PPC chip 2, a DSP chip 4 and an FPGA 5, and the PPC chip 2 and the DSP chip 4 and FPGA5 are respectively arranged in parallel, and PPC chip 2, DSP chip 4 and FPGA5 are all provided with three groups, the middle part of the upper end surface of sub-board 1 is provided with wiring groove 3, four corners of sub-board ...

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Abstract

The invention discloses an expandable processing board based on a high-speed and high-density connector, including daughter boards and carrier boards, a PPC chip is mounted on the upper end surface ofthe daughter board, DSP chip and FPGA, wherein that PPC chip, the DSP chip and the FPGA are respectively arrange in parallel, and the PPC chip, the DSP chip and the FPGA are all provided with three group, the middle part of the upper end surface of the daughter board is provided with a trace groove, and the four corners of the daughter board and the two corners of the carry board are all providedwith an extrusion block; the invention discloses an expandable processing board based on a high-speed and high-density connector, the scalability design can be realized by the first connector and thesecond connector, the invention can meet the needs of different scenes, reinforce the carrier plate, prevent the carrier plate from falling off, prevent the carrier plate and the daughter plate frombeing installed in a compact structure from being squeezed, and is completely suitable for the scenes with high vibration, meet the requirements of higher vibration requirements, and simultaneously have excellent heat dissipation performance, and can effectively dissipate heat to the processing board.

Description

technical field [0001] The invention relates to a processing board, in particular to an expandable processing board based on a high-speed, high-density connector. Background technique [0002] The processing board is an intelligent management control processing unit, embedded with a real-time multitasking operating system, which can be equipped with a variety of chips, processors and memories for use. It is mainly used in various Internet data processing equipment, which can process data Effective processing and storage, widely used in various Internet fields, most of the existing processing boards have better data processing capabilities, can meet application requirements, and have certain use effects, but there are also certain shortcomings , I believe that it will be further developed in the future to meet more usage needs. [0003] There are certain disadvantages in the use of existing processing boards. First, most of the existing processing boards do not have expandab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18
CPCG06F1/183G06F1/185
Inventor 徐金平蔡叠莫建军戢小龙
Owner 重庆秦嵩科技有限公司
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