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Package substrate, preparation method thereof, organic light emitting diode (OLED) display device and preparation method thereof

A technology for encapsulating substrates and display devices, which is applied in semiconductor/solid-state device manufacturing, electrical components, diodes, etc., and can solve problems such as incomplete curing of filling glue

Active Publication Date: 2019-03-15
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present invention provide a packaging substrate and its preparation method, an OLED display device and its preparation method, which can improve the problem of incomplete curing of the filler

Method used

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  • Package substrate, preparation method thereof, organic light emitting diode (OLED) display device and preparation method thereof
  • Package substrate, preparation method thereof, organic light emitting diode (OLED) display device and preparation method thereof
  • Package substrate, preparation method thereof, organic light emitting diode (OLED) display device and preparation method thereof

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] In the related art, the preparation process of the OLED display device includes: figure 1 As shown, the OLED substrate 01 is coated with a filler (Filler) 10, and then the encapsulation substrate 02 is attached to the filler 10, and then the filler 10 is cured, so as to realize the encapsulation of the OLED substrate 01. In the case where the light-emitting layer of an OLED display device (also called a WOLED display device) emits white light, such as ...

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Abstract

The embodiment of the invention provides a package substrate and preparation method thereof, an organic light emitting diode (OLED) display device and preparation method thereof and relates to the technical field of display, and the problem of incomplete curing of filling glue can be improved The package substrate comprises a substrate, color photoresist patterns disposed on the substrate, and black matrix patterns for separating the color photoresist patterns at intervals; the black matrix pattern comprises an alignment layer and a light shielding layer which are sequentially arranged on thesubstrate; the light shielding layer comprises liquid crystal, wherein the alignment layer is used for arranging long axes of the liquid crystal molecules in the direction perpendicular to or parallelto the substrate. The method is used for curing the filling glue.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an encapsulation substrate and a preparation method thereof, an OLED display device and a preparation method thereof. Background technique [0002] OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display device has become a very competitive and A class of display devices with good development prospects. [0003] An OLED display device includes an anode, a cathode, and a light-emitting layer. When a voltage is applied to the anode and the cathode, the light-emitting layer will emit light. Currently, there are two kinds of OLED display devices. One is that the light emitting layer can emit light of three primary colors such as red light, green light and blue light. The other is that the light-emitting layer emits white light. In the case of the light-emitting layer emitting white light, in order to realize color display, the OLED display device also includes a ...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/50H10K59/38H10K50/8426H10K50/865
Inventor 宋文峰
Owner BOE TECH GRP CO LTD
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