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Dynamic junction temperature calculation method of IGBT power module of wind power converter considering the influence of stray inductance

A wind power converter and stray inductance technology, which is applied to output power conversion devices, wind power generation, electrical components, etc. and other problems, to achieve the effect of improving thermal management control strategy, optimizing package heat dissipation design, and improving reliability

Active Publication Date: 2019-01-25
重庆平创半导体研究院有限责任公司
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Problems solved by technology

However, the calculation results based on the assumption of uniform steady-state current distribution and the average loss distribution of the module cannot accurately reflect the dynamic thermal stress distribution of its internal multi-chips, and it is difficult to characterize the weak links inside the power module of the converter

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  • Dynamic junction temperature calculation method of IGBT power module of wind power converter considering the influence of stray inductance
  • Dynamic junction temperature calculation method of IGBT power module of wind power converter considering the influence of stray inductance
  • Dynamic junction temperature calculation method of IGBT power module of wind power converter considering the influence of stray inductance

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Embodiment Construction

[0044] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0045] The preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. This embodiment selects a certain 1.5MW wind power converter IGBT module, the specific model is FF450R17ME4, and implements it under the premise of the technical solution of the present invention. The implementation mode and specific operation process.

[0046] figure 1 Shown is the specific calculation model of the method of the present invention. The purpose of the present invention is to provide a method for calculating the dynamic junction temperature of the wind power converter IGBT power module considering the influence of stray inductance. The method takes into account the influence of stray inductance , combined with the thermal network model considering the thermal coupling between chips, using ...

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Abstract

The invention relates to a method for calculating the dynamic junction temperature of an IGBT power module of a wind power converter considering the influence of stray inductance, The invention belongs to the technical field of high-power power electronic device reliability for new energy power generation. The method comprises the following steps: S1, establishing an equivalent circuit model of anIGBT module according to the dynamic uneven current between parallel multi-chips caused by stray inductors; S2: deriving The mathematical relationship between the stray inductance parameters and theswitching-on loss; S3: Introducing the equivalent thermal coupling impedance to establish the thermal network model considering the thermal coupling between chips; 4, establishing a dynamic junction temperature calculation model of that IGBT module, feeding the junction temperature distribution result back to a mathematical relation model of los, and iteratively obtaining the dynamic junction temperature distribution among chips in the IGBT module. The invention can accurately reflect the dynamic heat distribution inside the IGBT power module, effectively characterize the heat weak links inside the module, and improve the heat management control strategy of the wind power converter, thereby improving the reliability thereof.

Description

technical field [0001] The invention belongs to the technical field of reliability of high-power power electronic devices for new energy power generation, and relates to a method for calculating the dynamic junction temperature of an IGBT power module of a wind power converter considering the influence of stray inductance. Background technique [0002] As the hub of wind energy conversion system, wind power converter is an important link that affects the stable and reliable operation of wind turbines. However, the long-term, large-scale and frequent random output of the unit has caused the converter to continue to suffer severe thermal stress shocks, and has become one of the components with the highest failure rate. In order to meet the application requirements of large-capacity converter power modules for wind turbines, multi-chip parallel connection is generally used to increase the power level. However, the uneven current distribution between parallel multi-chips and the...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/32H02J3/38
CPCH02J3/386H02M1/32H02M1/327Y02E10/76
Inventor 李辉胡玉王坤郑媚媚姚然胡姚刚全瑞坤何蓓刘晓宇
Owner 重庆平创半导体研究院有限责任公司
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