Circuit etching device

An etching device and circuit technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit drying, etc., can solve the problems of inconvenient recycling of etching solution, decrease of circuit board yield, excessive corrosion of circuit board, etc., and achieve high usage and promotion. value, avoid excessive corrosion, avoid wasteful effects

Inactive Publication Date: 2019-01-15
天台县万进电子科技有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] When people etch circuits, they usually use soaking to etch circuits, but often due to poor timing control, the circuit boards are over-corroded, and the circuit boards are scrapped from time to time. The amount of etching solution is large and wasteful, so other etching methods are required
[0003] Now there are also some circuit board etching devices that use spraying to etch, but the spraying method is not easy to recycle the etching solution, and the waste is large, and these etching devices are often not cleaned and dried in time after the circuit board is etched. Leading to a decline in the yield rate of the circuit board

Method used

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Embodiment Construction

[0021] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0022] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0023] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the attached figure 1 The orientations or positional relationships shown are only for the c...

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Abstract

A circuit etching device includes the main body, A material feed groove extending to that right is arrange on the left end surface of the main body, An etch cavity extending downward is arrange on that bottom end wall of the feeding groove, A drying chamber is fixedly arranged in the main body on the right side of the feeding groove, a fan chamber is fixedly arranged in the main body above the drying chamber, and a conveying groove extending left and right is fixedly arranged in the main body below the feeding groove and the drying chamber. The circuit etching device of the invention is more reasonable and clever in overall structure, Through the cooperation of each step, the circuit board is clamped, the etchant is sprayed evenly, the circuit board is placed on the screen and conveyed into the cleaning device for cleaning, and finally the drying is carried out, and the steps are linked together, so that the circuit board has certain implementation significance.

Description

technical field [0001] The invention relates to the field of circuits, in particular to a circuit etching device. Background technique [0002] When people etch circuits, they usually use soaking to etch circuits, but often due to poor timing control, the circuit boards are over-corroded, and the circuit boards are scrapped from time to time. The amount of etching solution is large and wasteful, so other etching methods are needed. [0003] Now there are also some circuit board etching devices that use spraying to etch, but the spraying method is not easy to recycle the etching solution, and the waste is large, and these etching devices are often not cleaned and dried in time after the circuit board is etched. Lead to a decline in the yield of the circuit board. [0004] For this reason, it is necessary to further improve the existing circuit board etching device, thereby increasing the yield rate of the circuit board after etching. Contents of the invention [0005] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/22H05K3/26
CPCH05K3/068H05K3/227H05K3/26H05K2203/075H05K2203/1105
Inventor 毛擎
Owner 天台县万进电子科技有限公司
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