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Electrolytic nickel (alloy) plating solution

A plating solution and electrolytic nickel technology, which is applied to circuits, printed circuits, electrical components, etc., can solve the problems of cracks in precipitates, insufficient filling of electrolytic nickel plating solution, insufficient filling of tiny holes, and insufficient filling of tiny recesses

Active Publication Date: 2020-11-27
JAPAN PURE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, according to the additional tests conducted by the present inventors (example described later), it was found that the filling property of the electrolytic nickel plating solution described in Non-Patent Document 2 was not sufficient to suppress the generation of voids, and in addition, deposits would Cracks are generated, which is bad as a structure
[0012] The miniaturization of electronic circuits is progressing vigorously. In related known technologies, the filling performance of microscopic holes and microscopic recesses is not sufficient, and it is desired to develop a nickel filling method that does not cause defects such as holes or cracks.

Method used

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  • Electrolytic nickel (alloy) plating solution
  • Electrolytic nickel (alloy) plating solution
  • Electrolytic nickel (alloy) plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 4、 comparative example 1 to 3

[0101] A 12 mm square evaluation printed circuit board (manufactured by Nippon Circuit Co., Ltd.) having a laser hole with an aspect ratio of 0.88 (φ45 μm×40 μmD) was used as a model of the minute concave portion.

[0102] A sectional view of the periphery 10 of the plated portion is shown in figure 1 . Copper foil 13 with a thickness of 12 μm is attached to the through-hole forming part of the base material 11 made of BT (Bismaleimide-triazine) with a thickness of 0.4 mm, and a prepreg with a thickness of 60 μm is laminated thereon. After prepreg type build-up resin (build-up resin) 12, a blind via hole (blind via hole) with a diameter of 45 μm and a depth of 40 μm (hereinafter also referred to as “via hole” and “ In the case of a "via" 14, a seed layer 15 of about 1 μm is formed on the outer surface of the substrate (the surface of the build-up resin 12) and the inner wall of the through hole 14 by electroless copper plating.

[0103] Furthermore, it is formed by dry film ...

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Abstract

The object of the present invention is to provide an electrolytic nickel (alloy) plating solution, a nickel or nickel alloy plating filling method using the electrolytic nickel (alloy) plating solution, and a method for manufacturing a micro three-dimensional structure, wherein the electrolytic The nickel (alloy) plating solution can fill microscopic holes or microscopic recesses (14) in electronic circuit parts with nickel or nickel alloy (18) without causing defects such as holes or gaps. Furthermore, the present invention solves the above-mentioned problems by using an electrolytic nickel (alloy) plating solution containing a specific N-substituted carbonylpyridinium compound to fill minute holes or minute recesses (14).

Description

technical field [0001] The present invention relates to an electrolytic nickel plating solution or an electrolytic nickel alloy plating solution (hereinafter, these are also collectively referred to as "electrolytic nickel (alloy) plating solution"). Electrolytic nickel (alloy) plating solution for plating and filling tiny holes or tiny recesses in circuit components. [0002] In addition, the present invention also relates to a method of plating and filling microscopic holes or microscopic recesses using the electrolytic nickel (alloy) plating solution, and a method of manufacturing a microscopic three-dimensional structure. Background technique [0003] Electronic circuit components represented by semiconductors or printed circuit boards have micro holes or micro recesses such as vias, through holes, and trenches for forming wiring. In the past, when laminating multiple circuit boards to manufacture multi-layer printed circuit boards, the staggered via structure is the ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12
CPCC25D3/12C25D3/18C25D7/123H05K3/241
Inventor 柴田和也大平原祐树
Owner JAPAN PURE CHEM
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