Magnetron sputtering equipment and method for removing oxide layer on substrate
A technology of magnetron sputtering and oxide layer, which is applied in sputtering plating, coating, metal material coating process, etc., can solve the problems of panel performance and quality deterioration, affecting signal conduction, etc.
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[0031] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.
[0032] The implementation process of the embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0033] Generally, thin film deposition as used herein refers to the process of coating a substrate with a sputtered material. Herein, the term "coating" is used synonymously with the term "deposition". The ter...
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