A flexible board and an assembly fixture thereof which meet the industry standard

Abstract

The invention relates to a flexible board and an assembly fixture thereof which meet the industry standard, The flexible board comprises a flexible board body, A main via region and a standard pad region are arrange on the flexible board body, a group of electrical networks correspond to the electrical networks of optical device pins to be fabricated or tested is arranged in the main via region, and a group of standard pads correspond to the electrical networks of the main via are arranged in the standard pad region. The flexible board body further comprises a test pad region, wherein the testpad region is arranged between the main via region and the standard pad region; A set of test pads corresponding to the standard pad electrical network is provided in the test pad area. The inventionhas the beneficial effects that: by increasing the butt joint tolerance between the circuit board pad and the test pad, the poor butt joint or even misalignment of the flexible board body and the circuit board pad is not easy to occur when the test is carried out, so that the reliability and the yield of the optical device in the test process are improved.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a flexible soft board meeting industry standards and an assembly fixture thereof. Background technique [0002] In the case of limited space and volume, and with the development trend of high integration of optoelectronic devices and communication modules, the size of devices stipulated by industry standards is getting smaller and smaller, and the size of flexible boards is also getting smaller and smaller. In this way, in the process of manufacturing and testing optoelectronic devices and modules, because the pads of the flexible board are too dense, it is inevitable that the pad connection between the flexible board and the test circuit board will be poorly connected or even misaligned. , once the power is supplied, there is a great chance that the optoelectronic devices and modules being manufactured or tested will be damaged. Due to the above defects in the flex...

AI Technical Summary

Problems solved by technology

[0002] In the case of limited space and volume, and with the development trend of high integration of optoelectronic devices and communication modules, the size of devices stipulated by industry standards is getting smaller and smaller, and the size of flexible boards is also getting smaller and smaller. In this way, in the process of manufacturing and testing optoelectronic devices and modules, because the pads of the flexible board are too dense, it is inevitable that the pad connection between the flexible board and the test circuit board will be poorly connected or even misaligned. , once the power is supplied, there is a great chance that the optoelectronic devices and modules being manufactured or tested will be damaged. Due to the above defects in the flexible board with high-density pads and its press-fitting method, the optoelectronic devices and communication modules will be damaged during the manufacturing and testing process. damage or failure, and the defect rate increases

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