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A kind of potting glue for auxiliary gun probe and preparation method thereof

A technology of potting glue and auxiliary gun, which is applied in the field of high-temperature glue, can solve the problems of affecting the success rate of sampling and carbon determination, inconvenient use, and high price, so as to improve potting efficiency, low fluidity, and improve use performance effect

Active Publication Date: 2021-04-20
HUNAN RAMON SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These high-temperature-resistant inorganic potting adhesives have the disadvantage of being inconvenient to use, and often have grout leakage or cracking after curing, which affects the success rate of sampling and the accuracy of carbon determination; except for high-alumina cement, the price of the latter two is very expensive

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0032] The present invention also provides a preparation method of potting glue for sub-lance probes, comprising the following steps:

[0033] A) Drying, grinding and sintering 0.5-10 wt% active metal compound in sequence to obtain an activated powder;

[0034] B) ball milling and mixing the activated powder with the 10wt%-90wt% high-alumina fine powder, 5wt%-40wt% plate corundum, and 10wt%-50wt% water glass to obtain the potting glue for the sub-gun probe .

[0035] In the present invention, the kind, source and dosage of the active metal compound, high alumina fine powder, plate corundum and water glass are the same as those of the above active metal compound, high alumina fine powder, plate corundum and water glass, the source and the amount thereof are as follows: The dosage is the same and will not be repeated here.

[0036] In the present invention, the drying method of the active metal compound is preferably vacuum drying, preferably drying in a vacuum oven; the dryin...

Embodiment 1

[0046] Dry 10g of lithium carbonate (active metal compound) at 80°C, grind and heat up to 750°C at a rate of 2°C / min, and sinter for 6 hours to obtain an activated powder.

[0047]The obtained activated powder was ball milled for 7 hours with 40 g of high alumina fine powder, 38 g of plate alumina and 28 g of water glass at a ball milling speed of 60 r / min to obtain a potting compound.

[0048] The high-temperature-resistant inorganic potting compound prepared in this example has low fluidity and initial curing time of 15 minutes, but the curing strength can reach 54 MPa, the curing shrinkage is very small, only 0.05%, and the thermal shock stability is good, and the highest temperature resistance is 1720°C. It meets the high temperature resistance requirements on site, and can significantly improve the potting efficiency of sub-gun probes, without leakage, and after potting, it will cure without cracking. Potting quality is high.

Embodiment 2

[0050] Dry 8g of calcium chloride (active metal compound) at 85°C, grind and heat up to 780°C at a rate of 4°C / min, and sinter for 6 hours to obtain an activated powder.

[0051] The obtained activated powder was mixed with 45g of high alumina fine powder, 25g of plate alumina and 38g of water glass for 5 hours by ball milling at a ball milling speed of 100r / min to obtain a potting compound.

[0052] The high-temperature-resistant inorganic potting glue prepared in this example is light brown viscous glue, the initial curing time is 20min, the curing strength can reach 45MPa, the curing shrinkage is small, only 0.1%, and the thermal shock stability is good, and the maximum resistance is 1720 ℃. It meets the high temperature resistance requirements on site, and can significantly improve the potting efficiency of sub-gun probes, without leakage, and after potting, it will cure without cracking. Potting quality is high.

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Abstract

The invention provides a potting glue for sub-gun probes, which is made of the following components in mass fractions: 10-90wt% of high-alumina fine powder, 5-40wt% of plate corundum, 10-50wt% of water glass, 0.5-10wt% active metal compound; the active metal compound is one or more of active metal oxides, carbonates and chlorides; the active metal is one of zinc, aluminum, magnesium and calcium species or several. The present invention uses water glass as a solvent, adds active metal compounds, and further improves the performance of the potting glue. The potting glue in the present invention has a low fluidity and a short curing initial setting time, but the curing strength can reach 54MPa. The shrinkage is very small, only 0.05%, the thermal shock stability is good, and the highest temperature resistance is 1720°C. No leakage, no cracking after curing after potting. Potting quality is high. The invention also provides a preparation method of the potting glue for the sub-gun probe.

Description

technical field [0001] The invention belongs to the technical field of high-temperature glue, and in particular relates to a potting glue for sub-gun probes and a preparation method thereof. Background technique [0002] The sub-lance probe is a sensor with functions such as temperature measurement, sampling, oxygen determination, and carbon determination. It is mainly used in converters. Through the sub-lance probe, the temperature, carbon, oxygen, and liquid level can be continuously or individually measured without turning the furnace down. And sampling, greatly improving the operation rate of the converter. The sub-lance probe adopts a high-precision carbon-fixing chamber. By measuring the solidification temperature of the molten steel, the carbon content in the molten steel is calculated. At the same time, a steel sample with a special shape and thickness is taken out through the sampler for spectrum and gas analysis. Both the inlet of the carbon-fixing chamber and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J1/02
CPCC04B35/10C04B35/66C04B2235/3206C04B2235/3208C04B2235/3217C04B2235/3284C04B2235/3418C04B2235/96
Inventor 田陆
Owner HUNAN RAMON SCI & TECH
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