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Chip-on-film heat dissipation structure and display device

A technology of heat dissipation structure and chip-on-chip film, which is applied to the structural connection of printed circuits, circuits, and electrical solid-state devices, and can solve problems such as overheating and abnormality of integrated circuit chips

Active Publication Date: 2018-12-04
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The integrated circuit chip 110 is prone to overheating abnormalities

Method used

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  • Chip-on-film heat dissipation structure and display device
  • Chip-on-film heat dissipation structure and display device
  • Chip-on-film heat dissipation structure and display device

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Embodiment Construction

[0045] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0046] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0048] It should be understood that the ter...

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Abstract

The invention provides a chip-on-film heat dissipation structure and a display device. The chip-on-film heat dissipation structure comprises an integrated circuit chip, a first flexible circuit board,a heat conductive sheet and a second flexible circuit board; the integrated circuit chip comprises heat conducting pins, wherein the heat conducting pins are suspended without any potential; the first flexible circuit board includes a first base film, a first metal layer, and a first protective film; the second flexible circuit board includes a second base film, a second metal layer, and a secondprotective film; the integrated circuit chip is fixed on one side near the first protective film and away from the first base film, of the first flexible circuit board; the heat conductive pins penetrate the first protective film and contact the first metal layer; the first base film has a first opening; the first opening exposes a first portion of the first metal layer; the heat conductive sheetextends into the first opening and contacts the first metal layer; the second base film or the second protective film has a second opening, and the second opening exposes a second portion of the second metal layer; the heat conductive sheet extends into the second opening and contacts the second metal layer.

Description

【Technical field】 [0001] The invention relates to the field of display technology, in particular to a chip-on-chip heat dissipation structure and a display device. 【Background technique】 [0002] figure 1 It is a schematic cross-sectional view of a chip-on-film heat dissipation structure 100 in a conventional display device. The chip-on-chip heat dissipation structure 100 includes an integrated circuit chip 110 , a flexible circuit board 120 , and a heat conducting sheet 130 . The integrated circuit chip 110 is fixed on the flexible circuit board 120 . The heat conducting sheet 130 is disposed on a side of the integrated circuit chip 110 away from the flexible circuit board 120 . The integrated circuit chip 110 dissipates heat through the heat conducting sheet 130 during operation. Wherein, the heat dissipation area of ​​the heat conducting sheet 130 is close to the tiny size of the integrated circuit chip 110 . The heat dissipation rate of the heat conducting sheet 130...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373H05K1/14
CPCH01L23/3677H01L23/3736H05K1/147
Inventor 王战姝
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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