Multi-path high-performance server capable of improving heat dissipation performance and heat dissipation method thereof

Abstract

The invention discloses a multi-path high-performance server capable of improving heat dissipation performance and a heat dissipation method thereof, and belongs to the technical field of server heatdissipation. According to the multi-path high-performance server for improving the heat dissipation performance, a case is designed into an upper layer and a lower layer, a complete machine fan and aCPU radiator are arranged on the upper layer of the case, the whole machine fan is arranged at the rear end of the case, the CPU radiator is arranged at the front end of the case, the CPU radiator comprises a CPU radiator fin and a CPU cooling fan, the CPU cooling fan is connected to the CPU radiator fin, and the CPU cooling fan is arranged on the front side of the CPU cooling fin; and a power module, a hard disk storage module and a panel cooling fan are arranged on the lower layer of the case, the hard disk storage module is arranged at the front end of the case, the power supply module is arranged at the rear part of the case, and the panel cooling fan is arranged at the rear end of the case. According to the multi-path high-performance server for improving the heat dissipation performance, the heat dissipation can be enhanced, so that the reliability of server products is improved, and the popularization and application values are good.

Description

technical field [0001] The invention relates to the technical field of server heat dissipation, and specifically provides a multi-channel high-performance server with improved heat dissipation and a heat dissipation method thereof. Background technique [0002] At present, the multi-channel high-performance servers with four or more multi-core CPUs on the market are all commercial products. The depth of the products is relatively deep, and most of them exceed 800mm. At the rear end, there is enough distance between the fan and the CPU radiator and between the CPU radiator and the rear panel of the chassis (not less than 2 times the depth of the radiator) to ensure that the air flow in the system is as laminar as possible. [0003] The depth of military reinforcement products is mostly within 480mm, or even within 400mm. When the cooling fan of the whole machine is placed at the front of the chassis, it is impossible to reserve enough space to form an air duct, and it is impo...

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Problems solved by technology

[0003] The depth of military reinforcement products is mostly within 480mm, or even within 400mm. When the cooling fan of the whole machine is placed at the front of the chassis, it is impossible to reserve enough space to form an air duct, and it is impossible to ensure that the air flow in the system is in a laminar flow state, resulting in system failure. The air resistance is high, and the air volume effectively passing through the CPU radiator and other components is small, resulting in poor heat dissipation of the machine, unstable system operation or even downtime. Therefore, military hardened products cannot be transplanted with commercial product heat dissipation solutions, which brings great harm to the heat dissipation of military hardened products. certain obstacles

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