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Encapsulation system and method

A technology of potting and potting glue, which is applied in coatings, devices for coating liquid on the surface, etc., can solve the problems of poor effect and affecting heat dissipation, and achieve the effect of improving the effect and reducing the entry of air

Inactive Publication Date: 2018-11-16
ZHEJIANG PANGOOD POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, this potting method is more effective for proofing, but because the potting and curing steps are not carried out in the same environment, the effect after potting will be poor, and air will enter the potting compound, affecting heat dissipation

Method used

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  • Encapsulation system and method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] Please refer to figure 1 , this embodiment provides a potting system 100, which is used for potting the object to be potted formed by the assembly of the main stator and the casing of the axial field motor. It includes a glue discharging device 110 and a potting and curing device 120 .

[0033] Among them, see figure 2 , the glue discharging device 110 may include: a first barrel 111 , a first stirring impeller 112 , a second barrel 113 , a second stirring impeller 114 , a pipeline 115 , a regulating valve 116 and a glue discharging head 117 .

[0034] One end of the pipeline 115 communicates with the first barrel 111 and the second barrel 113 respectively, for example communicates with the bottom of the first barrel 111 and the second barrel 113 respectively, and the other end communicates with the bottom of the first barrel 111 and the second barrel 113 respectively, The valve 116 communicates with the glue outlet head 117 .

[0035] The first stirring impeller 11...

no. 2 example

[0062] Please refer to Figure 4 , the second embodiment of the present invention provides a potting method, which is applied to the potting system 100 described in any implementation manner in the first embodiment.

[0063] The methods include:

[0064] Step S110: Open the glue outlet device, so that the potting glue reaching the preset ratio starts to pot the object to be potted placed in the vacuum potting area, and at the same time pump the vacuum potting area Vacuum and heat.

[0065] Optionally, a plurality of objects to be potted are placed on the tray in the vacuum potting area, and the glue discharging device is opened, so that the potting glue that reaches a preset ratio starts to be placed in the vacuum potting area The described object to be potted in is potted, including:

[0066] Open the glue-discharging device so that the potting glue that reaches the preset ratio starts to perform multiple rounds of potting on the plurality of objects to be potted; wherein,...

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Abstract

The invention provides an encapsulation system and method. The encapsulation system comprises a glue discharging device and an encapsulation curing device. The encapsulation curing device comprises aconveying device, a vacuum encapsulation zone, a first curing zone and a second curing zone. The glue discharging device is used to inject encapsulation glue into the object to be encapsulated in thevacuum encapsulation zone. The first curing zone and the second curing zone cure the object to be encapsulated, automatically transferred into the first curing zone and the second curing zone throughthe conveying device. The encapsulation and curing fields are combined so that air inlet is reduced and the encapsulation effects are improved.

Description

technical field [0001] The invention relates to the field of potting, in particular to a potting system and a potting method. Background technique [0002] At present, the main stator and casing of the axial magnetic field motor are fixed by potting. The specific solution is to place the main stator in a closed space, and carry out potting of the potting glue in a vacuum state by pumping a vacuum. After potting, it is taken out from the closed space and cured in the oven. [0003] At present, this potting method is more effective for proofing, but because the potting and curing steps are not carried out in the same environment, the effect after potting will be poor, and air will enter the potting compound, affecting heat dissipation. Contents of the invention [0004] The purpose of the present invention is to provide a potting system and a potting method, which can alleviate the defects caused by the traditional filling method. [0005] Embodiments of the present invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C9/14B05C11/10
CPCB05C5/02B05C9/14B05C11/10
Inventor 杨浩吴星吴超
Owner ZHEJIANG PANGOOD POWER TECH CO LTD
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