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A kind of thermosetting polyimide and its application

A technology of polyimide and thermosetting, applied in the field of thermosetting polyimide, can solve the problems of thermosetting polyimide, low mechanical properties, and far difference, etc., and achieve good reprocessing characteristics and strong mechanical properties , good recyclable effect

Active Publication Date: 2021-03-09
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for precision parts with complex structures, the above method cannot be used to obtain
Although it has been reported in the literature that thermosetting polyimide with a certain complex shape has been successfully prepared by 3D printing technology, its high shrinkage rate and low mechanical properties are still far from practical applications.
[0003] To date, there are no reports on recyclable thermoset polyimide

Method used

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  • A kind of thermosetting polyimide and its application
  • A kind of thermosetting polyimide and its application
  • A kind of thermosetting polyimide and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Add 4,4'-diaminodiphenyl ether (33.15 mmol) into a 250 mL three-neck flask, add 100 mL of N,N-dimethylacetamide, add 2,3' in portions after dissolving, 3',4-biphenyltetracarboxylic dianhydride (30 mmol) was stirred at room temperature under nitrogen atmosphere for 24 h to obtain a polyamic acid solution with a certain viscosity.

[0032] 2. Measure toluene (10 mL) and add it to the prepared polyamic acid solution, heat reflux at 180°C in a dry nitrogen atmosphere for 24 hours, then pour it into industrial ethanol solution to precipitate precipitates, wash, suction filter, and heat at 150°C Dry in an oven for 36 hours to obtain polyimide oligomers.

[0033] 3. First, mix paraformaldehyde (1.25mmol) and deionized water (0.2 mL) into N, N-dimethylacetamide (4 mL), stir at 80 ℃ under a dry nitrogen atmosphere for 30 min until dissolved complete, that is, paraformaldehyde solution; secondly, mix polyimide oligomer (0.5 mmol) and N,N-dimethylacetamide (10 mL) at room temp...

Embodiment 2

[0041] 1,2,3,4,5 are carried out with the method of example 1.

[0042] 6. Configure H 2 SO 4 (16mol / L) solution and NaHCO 3 (24 mol / L) solution, soak the final thermosetting polyimide (0.2 g) in 100 mL H 2 SO 4 In the solution for 1 h, after it was completely decomposed, NaHCO was added dropwise 3 The solution was neutralized (PH=7, detected by test paper), filtered and washed to obtain a light yellow precipitate.

[0043] Carry out performance characterization analysis with the method of example 1.

Embodiment 3

[0045] 1. Add 4,4'-diaminodiphenyl ether (48mmol) and 3,4'-diaminodiphenyl ether (42mmol) into a 250 mL three-necked flask, add 100 mL N-methylpyrrolidone, and wait to dissolve Then, 2,3',3',4-biphenyltetracarboxylic dianhydride (30 mmol) was added in portions, and stirred at room temperature under nitrogen atmosphere for 12 h to obtain a polyamic acid solution with a certain viscosity.

[0046] 2. Measure toluene (10 mL) and add it to the prepared polyamic acid solution, heat reflux at 180°C in a dry nitrogen atmosphere for 36 hours, then pour it into industrial ethanol solution to precipitate precipitates, wash, suction filter, and heat at 150°C Dry in an oven for 24 h to obtain polyimide oligomers.

[0047] 3. First, mix paraformaldehyde (1.35mmol) and deionized water (0.05 mL) into N-methylpyrrolidone (6 mL), and stir at 80 ℃ for 30 min under a dry nitrogen atmosphere until it is completely dissolved, that is, paraformaldehyde solution; secondly, polyimide oligomer (0.5 m...

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Abstract

The invention discloses thermosetting polyimide. Firstly dianhydride 2, 3' 3', 4-biphenyl tetracarboxylic diandhydride and dianhydride 4, 4'-diaminodiphenyl ether and / or 3, 4'-diaminodiphenyl ether are taken to form a copolymerized linear ammonia end-blocking oligomer, and then the copolymerized linear ammonia end-blocking oligomer is gradually reacted with paraformaldehyde at low temperature, soas to form a cross-linked structure, and finally a hyperbranched polyimide film material is formed through a tape casting method. The invention further discloses application of the thermosetting polyimide to realizing of complex 3D structures. The thermosetting polyimide has the properties, such as repairability, excellent reprocessing property, high mechanical property, good temperature resistance and recoverability, and is expected to be a new generation of environment-friendly material to be applied to precision components with complex structures.

Description

technical field [0001] The present invention relates to a thermosetting polyimide and its use in the realization of complex 3D structures, the material has good repair properties, weldability and recyclability. Background technique [0002] As a high-performance polymer, polyimide is widely used in advanced fields such as aerospace, especially thermosetting polyimide and its composite materials. Thermosetting polyimide is known as a material that can replace some metals in the 21st century due to its excellent temperature resistance and outstanding mechanical properties, and has become one of the indispensable materials in cutting-edge technology fields such as global rockets and aerospace. However, as we all know, the main disadvantages of thermosetting resins are: 1) It cannot be repaired or reprocessed after thermosetting molding; 2) It cannot be recycled or degraded. With the rapid development of high technology in recent years, the development of polymers has also ente...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G81/00C08G73/10C08J5/18B33Y10/00B33Y70/00
CPCB33Y10/00B33Y70/00C08G73/1007C08G73/1071C08G81/00C08J5/18C08J2387/00
Inventor 王廷梅段春俭王齐华杨增辉
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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