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A kind of gold plating solution and a kind of gold plating method

A gold-plating solution and electroplating solution technology, applied in the field of gold-plating solution and gold-plating, can solve problems such as the failure of industrialization of restrictive factors, and achieve the effect of avoiding fatal defects and clean production

Active Publication Date: 2019-10-22
泉州益丰贵金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, with Au(pph 3 )Cl or Au(pph 3 ) The new plating solution system with Br as the main salt has also been tried in practice, but there are still many restrictive factors that have not been industrialized

Method used

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  • A kind of gold plating solution and a kind of gold plating method
  • A kind of gold plating solution and a kind of gold plating method

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preparation example Construction

[0022] The gold plating solution provided by the present invention includes potassium iodoaurate at a concentration of 6-20 g / L, preferably 8-18 g / L, more preferably 10-15 g / L, calculated as Au. In the present invention, there is no special limitation on the source of the potassium iodaurate, and commercially available products well known to those skilled in the art or self-made potassium iodurate can be used. In the present invention, the preparation method of potassium iodaurate preferably comprises the following steps: (1) under stirring conditions, potassium iodide aqueous solution is added in batches in gold source aqueous solution, carry out precipitation reaction, after filtering, washing and Drying to obtain solid gold iodide; (2) adding the solid gold iodide obtained in the step (1) into potassium iodide aqueous solution, complexation reaction occurs, concentrated and crystallized, and dried to obtain potassium iodoaurate.

[0023] In the present invention, the molar ...

Embodiment 1

[0039] The gold plating solution is an aqueous solution comprising the following components: Potassium iodoaurate, calculated as Au, with a concentration of 20g / L, tetramethylammonium iodide 6g / L, EDTA 8g / L, sodium citrate 80g / L, citric acid 50g / L, cobalt sulfate heptahydrate 2g / L;

[0040] The preparation method of described Potassium Chloraurate comprises the following steps:

[0041](1) Under the condition of stirring at 300rpm, the potassium iodide aqueous solution that the concentration is 317g / L is added in batches to the chloroauric acid aqueous solution that the concentration is 100g / L, carries out precipitation reaction 30min, through filtering, washing and drying, obtains solid iodine Gold; Wherein, the molar ratio of potassium iodide and gold source is 3:1;

[0042] (2) the solid gold iodide that described step (1) is obtained is joined in the potassium iodide aqueous solution that concentration is 169g / L, complexation reaction 30min occurs, through concentrated c...

Embodiment 2

[0048] The gold-plating solution is an aqueous solution comprising the following concentrations of components: Potassium iodateaurate, calculated as Au, with a concentration of 6g / L, tetramethylammonium iodide 5g / L, EDTA 8g / L, sodium citrate 60g / L, citric acid 50g / L, nickel sulfate heptahydrate 2g / L; The preparation method of described potassium iodauric acid is identical with embodiment.

[0049] A gold plating method, comprising the steps of:

[0050] Place the copper substrate in the above gold plating solution for electroplating; the pH value of the electroplating solution is 4.5-5.2, the temperature of electroplating is 25°C, and the current density of electroplating is 0.4A / dm 2 , the area ratio of cathode and anode is 2:1; the electroplating time is 15s.

[0051] GB / T34625-2017 C-QA-LAB-006 was used to test the performance of the coating, and the results are shown in Table 1.

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Abstract

The invention provides gold plating liquid and belongs to the technical field of electroplating solutions. The gold plating liquid provided by the invention comprises an aqueous solution composed of,by concentration of Au, 6-20 g / L of auric potassium iodide, 3-8 g / L of tetramethyl ammonium iodide, 8-15 g / L of EDTA and 80-130 g / L of a pH controlling agent. The gold plating liquid adopts the auricpotassium iodide as main salt, and the stability of the auric potassium iodide and the tetramethyl ammonium iodide which are matched for use can be close to that of gold plating liquid with aurous potassium cyanide as main salt; in addition, the acidic system is stable, and gold plating of precision electronic devices is quite facilitated. Furthermore, the auric potassium iodide belongs to a common chemical, and the gold plating liquid is free of toxicity and environmentally friendly and can be produced industrially. From the embodiment, by adopting the gold plating liquid, the density of theobtained plating layer is 17.36-17.83 g / cm<2>, the hardness is 133-236 mHV20, and the internal stress is 58-162 N.mm<-2>.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a gold plating solution and a gold plating method. Background technique [0002] Gold has good electrical conductivity, high chemical stability, corrosion resistance, and gorgeous color. Therefore, gold plating has become an indispensable technical means for electrical appliances, electronic components, and national defense technology. [0003] The gold-plated main salt is currently KAu(CN) 2 and KAu(CN) 4 The dosage is the largest and the effect is the best, but the safety risks and environmental risks caused by fatal toxicity are becoming increasingly prominent. Scientists have been working hard to find alternatives, but so far no compounds that are stable enough to replace cyanide have been found. [0004] Sulfite gold salt (sodium salt, potassium salt or ammonium salt) gold plating has a history of more than 60 years, and it is quite mature for decorative coating. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/48C25D5/00C25D17/10
Inventor 许良秋许朝龙石文清
Owner 泉州益丰贵金属科技有限公司
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