Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board production monitoring system and method

A technology for printed circuit boards and monitoring systems, applied in transportation and packaging, conveyor control devices, conveyors, etc., can solve the problems of continuous welding, poor welding ability, and inability to completely remove oxides, and achieves significant effects and uses. simple effect

Inactive Publication Date: 2018-10-30
WUHU MOTIONTEC AUTOMOTIVE
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The defects caused by solder paste account for more than half of the defects in SMT. If the solder paste on the printed circuit board is exposed to the air for too long, it will aggravate the oxidation and moisture absorption of the solder paste. The solvent in the solder paste will volatilize too much and become sticky, which will help Excessive volatilization of flux can easily lead to the inability to completely remove oxides during soldering, which directly leads to poor soldering ability, and even directly leads to false soldering and continuous soldering of printed circuit boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board production monitoring system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Such as figure 1 As shown, a printed circuit board production monitoring system includes a circuit board conveying device, a circuit board sensing device is arranged above the conveying device, the sensing device is connected to the processor 1, and the processor 1 is also connected to an alarm device. Described alarm comprises timer 2 and buzzer 3, and timer 2 and buzzer 3 all circuit connections processor 1. Alarm also includes indicator light 4.

[0019] Specifically, the transmission device is a conveyor belt 5, and an infrared distance measuring sensor 6 is arranged above the conveyor belt 5 as a circuit board sensing device. 7 is sent to the reflow soldering to carry out the reflow of surface mount components, and within 30 minutes (the time can be adjusted appropriately) is preset in the processor 1, when the circuit board 7 passes by on the conveyor belt 5, the emission of the infrared distance measuring sensor 6 terminal reflects a signal to the receiving end...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed circuit board production monitoring system. The system is provided with a conveying belt used for conveying a circuit board in the production process. An induction device used for inducting the circuit board on the conveying belt is arranged beside the conveying belt. The induction device outputs induction signals to a processor. The processor is provided with a timer and a buzzer. The printed circuit board production monitoring system can monitor printed circuit board production, an alarm is given for printed circuit board tin cream timeout, timeout monitoring is conducted on the printed circuit board, the alarm giving prompting function is achieved, usage is simple, and functions are obvious.

Description

technical field [0001] The invention relates to the technical field of circuit board production equipment, in particular to a printed circuit board solder paste overtime alarm. Background technique [0002] In the common application of current reflow soldering technology, solder paste has become the most important material in surface mount technology (SMT). In the reflow soldering of surface mount components, solder paste is used to implement the leads of surface mount components Or the connection of an endpoint to a pad on a printed circuit board. Before the reflow soldering of the printed circuit board, controlling the placement environment and placement time of the solder paste on the printed circuit board is a key process of SMT, which directly affects the soldering quality and reliability of surface mount components. [0003] The defects caused by solder paste account for more than half of the defects in SMT. If the solder paste on the printed circuit board is exposed ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G43/08
CPCB65G43/08B65G2203/045
Inventor 沈强雍成林程永海汪义文
Owner WUHU MOTIONTEC AUTOMOTIVE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products