Board repairing method based on PCBA board poor welding spot infrared positioning and correcting apparatus

Abstract

The invention discloses a board repairing method based on a PCBA board poor welding spot infrared positioning and correcting apparatus. The correcting apparatus comprises a rack, a host for storing to-be-corrected PCBA board poor welding spot coordinate information, an automatic transmission apparatus, an infrared positioning system, a display screen and a PLC control system; the automatic transmission apparatus is arranged in an X direction and runs through the two ends of the rack; a stop operation mechanism used for enabling the to-be-corrected PCBA board on the automatic transmission apparatus to stop moving in a lifting up process and enabling the corrected PCBA board to move along with the automatic transmission apparatus in a lifting down process is arranged between the two sides ofthe automatic transmission apparatus; and the infrared positioning system is correspondingly arranged above the automatic transmission apparatus, and comprises an infrared indicator lamp, a dual-railmovement assembly for driving the indicator lamp to perform reciprocating motion in the X and Y directions, and a keyboard for controlling the infrared indicator lamp to move from a former poor welding spot to the next poor welding spot. By adoption of the board repairing method, convenience in use and accurate positioning are realized; and the infrared positioning system can indicate the poor welding spots one by one and can be used for PCBA boards of different widths.

Description

technical field [0001] The invention relates to the field of PCBA board processing, in particular to a board repairing method using an infrared positioning correction device for defective solder joints of a PCBA board. Background technique [0002] There are a large number of electronic components welded on the PCBA board, and there are inevitably bad solder joints. It is necessary to inspect the PCBA board and repair the position of the bad solder joints. In the prior art, manual kanban is usually used. Repairing, that is, picking up the entire PCBA board manually, and carefully observing the specific conditions at each solder point, the labor intensity is high, the work efficiency is low, and it is easy to miss inspections, which affects the consistency of the product; There is a situation where solder joint inspection is performed while manual repairing is performed corresponding to the detected bad solder joints. This method requires the operator to frequently raise the ...

AI Technical Summary

Problems solved by technology

[0002] There are a large number of electronic components welded on the PCBA board, and there are inevitably bad solder joints. It is necessary to inspect the PCBA board and repair the position of the bad solder joints. In the prior art, manual kanban is usually used. Repairing, that is, picking up the entire PCBA board manually, and carefully observing the specific conditions at each solder point, the labor intensity is high, the work efficiency is low, and it is easy to miss inspections, which affects the consistency of the product; There is a situation where solder joint inspection is performed while manual repairing is performed corresponding to the detected bad solder joints. This method requires the operator to frequently raise the head to check the bad solder joints and lower the head to perform manual repair welding, which increases eye and neck fatigue. degree, it is easy to cause cervical spine strain and low work efficiency

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