Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate connection process and substrate assembly of LED automobile headlamp

A technology for substrates and headlights, applied in connection, motor vehicles, road vehicles, etc., can solve problems such as labor-intensive, time-consuming connection between substrates and substrates, low product consistency, etc., and achieve uniform specifications and high product consistency.

Active Publication Date: 2018-10-12
SHENZHEN YIKE PHOTOELECTRIC TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned problems in the prior art, the present invention provides a substrate connection process for LED automotive headlights, which can solve the problems of time-consuming, labor-intensive, and low product consistency in the prior art for connecting substrates , easy to produce; the present invention also provides a substrate assembly manufactured by the substrate connection process of this kind of LED automobile headlight

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate connection process and substrate assembly of LED automobile headlamp
  • Substrate connection process and substrate assembly of LED automobile headlamp
  • Substrate connection process and substrate assembly of LED automobile headlamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0032] The invention provides a substrate connection process for LED automotive headlights, such as figure 1 and figure 2 As shown, it includes the following steps: A, setting the first substrate 1 and the second substrate 2 to be connected, the first substrate 1 includes the first pad 11, and the second substrate 2 includes the second pad 21; B, setting the flexible Substrate 3, flexible substrate 3 includes the third pad 31 and the fourth pad 32 electrically connected by means of substrate wiring; C, make the first pad 11 and the third pad 31 align and solder, the second pad 21 and the fourth pad 32 are aligned and soldered.

[0033] Preferably, before step C, solder paste is brushed on the first pad 11 and / or the third pad 31 , and solder paste is brushed...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of LED automobile headlamp manufacturing, in particular to a substrate connection process of an LED automobile headlamp. The substrate connection process comprises the following steps of A, arranging a first substrate to be connected and a second substrate to be connected, wherein the first substrate comprises a first bonding pad, and the second substrate comprises a second bonding pad; B, arranging a flexible substrate, wherein the flexible substrate comprises a third bonding pad and a fourth bonding pad, and the third bonding pad and the fourth bonding pad are electrically connected by a substrate wire; and C, allowing the first bonding pad and the second bonding pad to be aligned and welded, and allowing the second bonding pad and the fourthbonding pad to be aligned and welded. By the process, the problems of time and labor consumption of connection between the substrates in the prior art and low product consistency can be solved, and production is facilitated. The invention also provides a substrate assembly of the LED automobile headlamp.

Description

technical field [0001] The invention relates to the technical field of manufacturing LED automobile headlights, in particular to a substrate connection process for LED automobile headlights and a substrate assembly manufactured by using the substrate connection process for LED automobile headlights. Background technique [0002] At present, most of the known LED automotive headlight industries use copper substrates, aluminum substrates or PCBs (printed circuit boards) as the fixing and thermal and conductive media of LED lamp beads, and the substrates are collectively referred to below. The LED lamp beads in the LED car headlights conduct electricity with the help of the lines on the substrate, and the heat generated by the LED lamp beads is conducted through the substrate to other heat conduction channels with high thermal conductivity. However, the commonly used substrates cannot be bent at large angles due to the characteristics of their materials. Theoretically, the maxi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01R43/02F21V19/00F21W102/13F21W107/10F21Y115/10
CPCF21V19/0025F21W2102/13F21W2107/10F21Y2115/10H01R43/0256H01R43/0263
Inventor 张鹏
Owner SHENZHEN YIKE PHOTOELECTRIC TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com