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An environmental stress screening time optimization method and equipment

A technology of environmental stress screening and optimization methods, applied in multi-objective optimization, design optimization/simulation, data processing applications, etc., can solve problems such as reliability can no longer be greatly improved, production costs increase, etc.

Active Publication Date: 2021-02-09
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if excessive stress screening is carried out on the product, the product has entered the accidental failure period, and its reliability in use is close to the design reliability. Not only the reliability cannot be greatly improved, but because of the long screening time, the production The cost is greatly increased, and the gain outweighs the gain

Method used

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  • An environmental stress screening time optimization method and equipment
  • An environmental stress screening time optimization method and equipment
  • An environmental stress screening time optimization method and equipment

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Embodiment Construction

[0080] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0081] The life cycle of electronic product components during the warranty period generally has the following three stages: component-level screening, which applies environmental stress to components and screens out defective components; component-level screening, where components are assembled to circuit boards through connectors After uploading, environmental stress screening is carried out on...

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Abstract

The invention discloses an environmental stress screening time optimizing method and environmental stress screening time optimizing equipment for an electronic product, and belongs to the field of reliability tests of electronic products. Environmental stress screening is an important means for eliminating early failures of a product, and is achieved by applying an appropriate environmental stressto the product before leaving a factory and eliminating potential defects so as to guarantee using reliability of the product. Implementation of the environmental stress screening can reduce the maintenance cost after the product is put into use while the production cost is increased. During the environmental stress screening, component-level and assembly-level screening cost is fully considered,and especially calculation of time and expense cost is introduced, so that the screening time cost is fully considered during the environmental stress screening, and while the design reliability is improved, the screening time is shortened and the production cost is reduced so as to improve the economic efficiency and the production efficiency of an enterprise.

Description

technical field [0001] The invention belongs to the field of reliability testing of electronic products, and more specifically relates to a method and equipment for optimizing the environmental stress screening strategy of electronic products. Background technique [0002] Environmental stress screening is a kind of reliability test. By applying appropriate environmental stress to the product, potential defects in the product can be effectively eliminated, the product can enter the accidental failure period as soon as possible, and the reliability of the product in the use stage can be improved. According to past experience, when a failure occurs, repairs are made at a lower assembly level, and the repair cost is lower. As the assembly level increases by one level, the maintenance cost increases by almost an order of magnitude. If the product fails after it is put into use, the maintenance cost will be higher. Environmental stress screening can eliminate potential defects ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06Q10/04G06Q10/00G06F30/27G06F111/06G06F119/02G06F119/14
CPCG06Q10/04G06Q10/20
Inventor 刘文杰金健张航军
Owner HUAZHONG UNIV OF SCI & TECH
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