Heat radiation and diversion cabinet

Abstract

The invention discloses a heat radiation and diversion cabinet comprising a cabinet body which is internally provided with a first air duct and a second air duct. The first air duct comprises a firstair inlet which is arranged on the bottom part of the cabinet body and a first air outlet which is arranged in the middle part of the cabinet body. The second air duct comprises a second air inlet which is arranged in the middle part of the cabinet body and a second air outlet which is arranged on the top part of the cabinet body. The first air outlet and the second air inlet are perpendicular tothe cabinet body panel. The heat radiation and diversion cabinet also comprises a separating plate which is installed between the cabinet body panel and the mainboard. The separating plate is arrangedon the position between the first air outlet and the second air inlet. Cold air intaking and hot air discharging can be independently performed, two sets of air ducts have no mutual interference andthe air temperature superposition effect does not occur so that the heat radiation effect is great; besides, the system flow resistance is low so that the rotating speed of the equipment fan can be reduced, the electric energy consumed for high speed rotation of the fan can be saved, and the comprehensive effect of energy conservation and emission reduction can be achieved.

Description

technical field [0001] The invention relates to the field of heat dissipation devices for electronic equipment, in particular to a heat dissipation guide cabinet. Background technique [0002] At present, for large-scale communication equipment, the power consumption of the motherboard in the cabinet is increasing, and the number of motherboards is also increasing. With the increasing heat flux density of the motherboard of large-scale equipment, the uppermost motherboard is in a high-temperature environment for a long time, and the heat on the motherboard is sensitive. There is a risk of overheating of the device temperature, which will shorten the life of the core device, accelerate aging, and even damage the device and the main board, resulting in the failure of the device or the main board to operate normally. [0003] For the heat dissipation inside the large-scale communication equipment cabinet, the existing technology usually adopts the following air duct solutions: ...

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Problems solved by technology

[0006] 2. The equipment is noisy. The heat dissipation of this kind of air duct equipment mainly depends on increasing the air volume, which leads to the continuous increase of the fan speed, and the noise problem of the equipment is becoming more and more serious. Exceeding the noise will have a negative impact on the staff and even affect the surrounding environment

[0007] 3. The power consumption of the fan is large. As the fan speed increases, the power consumed by the fan is proportional to the cube of the fan speed. When the fan speed is doubled, the power consumed by the fan will increase by 8 times, that is, it takes 8 times the power to exchange 1 times the air volume, the energy efficiency ratio is reduced

[0009] 1. It is inconsistent with the air duct form of the existing machine room. Since the hot air of the equipment is discharged from the bottom and mixed with the cold air blown from the bottom of the machine room, the temperature of the air entering the middle of the equipment will increase and the cooling efficiency of the machine room will be reduced.

[0010] 2. The flow resistance of the system is large, the air enters the upper gap from the middle motherboard panel through the middle motherboard, and then enters the uppermost motherboard to discharge hot air

[0012] 1. Only applicable to 300 deep cabinets, not applicable to 600 deep cabinets, because 600 deep cabinets place equipment back to back, and after one side of the equipment adopts a flow guide device, the hot air discharged from the rear will affect the heat dissipation of the equipment on the other side of the cabinet

[0013] 2. It can only be placed in the gap between equipment and equipment, occupying the space of the communication equipment cabinet

[0014] 3. The device is independent of the equipment and needs to be installed later, which will affect the overall appearance of large equipment

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