An improved solvent-free gluing system

A solvent-free and improved technology, used in devices and coatings that apply liquid to surfaces, and can solve problems such as solvent-free glue coagulation, pipe blockage, and difficulty in cleaning.

Active Publication Date: 2020-09-08
山东统海包装材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an improved solvent-free gluing system, which solves the problem that the air in the factory building directly enters the storage tank, which may easily cause the solidification of the solvent-free glue and cause the solvent-free glue to adhere to the storage material. On the wall of the barrel, it is very difficult to clean up later, and it is easy to cause the problem of pipeline blockage

Method used

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  • An improved solvent-free gluing system
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  • An improved solvent-free gluing system

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In describing the present invention, it is to be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "surrounding" etc. Indicating orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in...

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Abstract

The invention discloses an improved type solvent-free gluing system. The improved type solvent-free gluing system comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a controller; the surface of the controller is fixedly connected with a power line; material storage buckets are fixedly connected with the top of the bottom plate and two sides of the controller; the surfaces of the material storage buckets are communicated with connection pipes; the invention relates to the technical field of solvent-free gluing devices. By adopting the improved type solvent-free gluing system, the aim of conveniently drying air in a factory is realized; water vapor is evaporated through high temperature and is absorbed through drying cotton, and the humidity is reduced toa suitable range, so that dehumidified air is convenient to cool; the temperature is controlled in a suitable range, so that the solvent-free glue is prevented from being influenced by the temperature and the solvent-free glue in the material storage buckets is prevented from being condensed and is convenient for people to use; the practicability of the device is improved and the sealing performance of a box cover is improved; external gas is prevented from entering the material storage buckets, the heat dissipation efficiency is improved and heat dissipation is more complete.

Description

technical field [0001] The invention relates to the technical field of solvent-free gluing devices, in particular to an improved solvent-free gluing system. Background technique [0002] Solvent-free glue is a new type of glue synthesized by advanced technology using a new generation of materials. With the strengthening of environmental protection and safety awareness, solvent-free glue is attracting more and more attention from flexible packaging companies. At present, the adhesives commonly used in domestic packaging materials are mainly solvent-based polyurethane adhesives, accounting for more than 90% of composite adhesives. Water-based or solvent-free composite adhesives have been widely used in the field of food flexible packaging. Water-based and solvent-free lamination adhesives have accounted for nearly 60% of the flexible packaging lamination adhesive market. Compared with solvent-based adhesives, water-based and solvent-free lamination adhesives have the advantag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/11B05C11/10
CPCB05C11/10B05C11/11
Inventor 朱元金徐相峰何庆君
Owner 山东统海包装材料有限公司
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