Plastic packaged quartz crystal resonator and preparation method thereof

A quartz crystal and plastic packaging technology, applied in electrical components, impedance networks, etc., can solve the problems of reduced production efficiency and product yield, high manufacturing costs, and inability to meet market demands, achieving high flexibility and reduced electroplating area. Effect

Inactive Publication Date: 2018-08-24
瓷金科技(广东)有限公司
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a plastic-encapsulated quartz crystal resonator and a preparation method thereof, which solves the problems of high manufacturing cost, reduced production efficiency and product yield rate of the existing ceramic-encapsulated quartz crystal resonator, which is far from being able to meet the growing market demand, etc. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plastic packaged quartz crystal resonator and preparation method thereof
  • Plastic packaged quartz crystal resonator and preparation method thereof
  • Plastic packaged quartz crystal resonator and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 and 2As shown, a plastic-encapsulated quartz crystal resonator includes a cover plate 1, a quartz wafer 7, a conductive glue 9 and a base 2. The cover plate 1 is a translucent plastic cover plate formed by injection molding, and the cover plate 1 is provided with a groove 3 for accommodating the protrusion 4 on the base 2, the quartz wafer 7 is an electrode-plated quartz wafer 7, the base 2 includes an opaque plastic body and conductive pins, the An accommodating chamber 8 for containing a quartz wafer 7 and a protrusion 4 corresponding to the groove 3 are arranged on the opaque plastic body, and the conductive pins are combined with the opaque plastic body through a nano-injection molding process, so The above-mentioned quartz wafer 7 plated with electrodes is cured in the accommodation chamber 8 through conductive glue 9 and connected to the conductive pins. The cover plate 1 and base 2 are fixed together to seal the quartz wafer 7 .

[0040] The co...

Embodiment 2

[0043] Such as image 3 and 4 As shown, it is basically the same as Embodiment 1, the difference is that the crystal resonator is a three-pin quartz crystal resonator, and the three-pin quartz crystal resonator also includes a ground pin 11, and the ground pin 11 is arranged on three pin middle of the quartz crystal resonator. The power connection pin is a Z-shaped pin 5, and an injection hole is provided on the opaque plastic body corresponding to the Z-shaped pin 5. Setting the injection hole can ensure that the metal will not be deformed by the impact force of the plastic during injection molding, which can effectively improve product quality and yield. The injection holes can be set in different shapes as required, and square holes 10 are used in this embodiment.

Embodiment 3

[0045] Such as Figure 5 and 6 As shown, it is basically the same as Embodiment 1, the difference is that the crystal resonator is a four-pin quartz crystal resonator, and the four-pin quartz crystal resonator includes two power-connecting pins and two grounding pins Pin 11, the described electrical connection pins and grounding pins 11 are alternately arranged at the four corners of the four-pin quartz crystal resonator, and the described electrical connection pins can be in any shape, and the present embodiment is a square lead Feet 12.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a plastic packaged quartz crystal resonator, comprising a cover plate, a quartz wafer, a conductive adhesive and a base, wherein the cover plate is a plastic cover plate, thequartz wafer is an electrode-plated quartz wafer, the base comprises a plastic body and a conductive pin that are combined together by a nano-injection molding process, the electrode-plated quartz wafer is solidified in a receiving chamber by the conductive adhesive and is connected to the conductive pin; the cover plate is a permeable plastic cover plate and is peripherally provided with a groovefor receiving protrusions on the base, the plastic body is an opaque plastic body that is provided with a receiving chamber for accommodating a quartz wafer and a projection corresponding to the groove, and the cover plate and the base are fixed by laser welding to seal the quartz wafer. The product of the invention breaks the limitation of the metal and ceramic seal in the crystal industry, andbrings more selectivity to the products used by the customer.

Description

technical field [0001] The invention relates to a plastic packaged quartz crystal resonator and a preparation method thereof, belonging to the field of quartz crystal resonators. Background technique [0002] Quartz crystal resonators are widely used in various systems such as global positioning system (GPS) and mobile communication. Quartz crystal resonators are packaged in metal and ceramic, meeting the light, thin, short, and small requirements of portable products represented by mobile phones. The packaging of quartz crystal resonators has changed from traditional bare metal shells to those covered with plastic metal and ceramic packages. change. The traditional crystal resonator ceramic package includes at least 2 layers of ceramic substrates, and a cover fixed to the ceramic substrates. The inner ceramics are provided with internal electrodes, and the outer ceramic substrates are provided with external electrodes. The internal electrodes and the external electrodes ar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/10H03H9/19
CPCH03H3/02H03H9/10H03H9/19
Inventor 禹贵星
Owner 瓷金科技(广东)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap