Improved integrated chip packaging equipment

Abstract

The invention discloses improved integrated chip packaging equipment comprising a base, an elevator body arranged on the left side of the top end face of the base, and a chip mount arranged on the right side of the top end face of the base; the right end face of the elevator body is provided with a first slide guide slot; a support plate is connected in the first slide guide slot in a slide manner; the right end of the support plate extends outside the first slide guide slot and is above the chip mount; a first screw rod extending up and down is threaded in the support plate in the first slideguide slot; the bottom extension end of the first screw rod and the bottom inner wall of the first slide guide slot are rotatably matched and connected; the top extension end of the first screw rod is in power connection with a first motor; the improved integrated chip packaging equipment is simple in structure, easy to operate, easy to store, easy to move and carry, and can improve the packagingefficiency and effect.

Description

technical field [0001] The invention relates to the technical field of integrated chip production, in particular to an improved integrated chip packaging device. Background technique [0002] At present, integrated chips have become the essential core electronic components of global electronic products, and there are certain strict requirements for the packaging of integrated chips. The general and traditional improved integrated chip packaging equipment adopts rough packaging, and the operation is complicated, which will cause irreparable damage. As a result, the soldering of the chip pins is rough, the original circuit is destroyed, and the impurities cannot be effectively removed during packaging, which affects the electrothermal performance of the chip. At the same time, due to inaccurate installation and positioning, subsequent assembly of the whole machine is very difficult, and the operation of general packaging equipment is consistent. Inaccurate welding affects th...

AI Technical Summary

Problems solved by technology

[0002] At present, integrated chips have become the essential core electronic components of global electronic products, and there are certain strict requirements for the packaging of integrated chips. The general and traditional improved integrated chip packaging equipment adopts rough packaging, and the operation is complicated, which will cause irreparable damage. As a result, the soldering of the chip pins is rough, the original circuit is destroyed, and the impurities cannot be effectively removed during packaging, which affects the electrothermal performance of the chip. At the same time, due to inaccurate installation and positioning, subsequent assembly of the whole machine is very difficult, and the operation of general packaging equipment is consistent. Inaccurate welding affects the packaging efficiency and the quality of the chip itself, so an improved integrated chip packaging equipment is urgently needed

Images