Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for manufacturing circuit through liner plate engraving process

A liner and circuit technology is applied in the field of devices for making circuits by the liner engraving method, and can solve the problems of inability to adapt to low cost, high efficiency, complicated manufacturing process, small size and the like

Pending Publication Date: 2018-08-03
GUANGDONG POWER GRID CO LTD +1
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, although many manufacturing processes for the circuit in the circuit board are provided, most of the manufacturing processes are complicated and costly. Due to the complex structure of the circuit board and the small size, the circuit board in the prior art The production method cannot meet the requirements of low cost and high efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for manufacturing circuit through liner plate engraving process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] like figure 1 As shown, the present invention provides a device for making a circuit by lining board engraving method. The device includes a frame 1 as a supporting device. The frame 1 is provided with a stand 2 on which a backing board twenty one. The platform 2 is connected to the frame 1 through the first driving device 4, the driving end of the first driving device 4 is connected to the platform 2, and the platform 2 can move relative to the frame 1 under the action of the first driving device 4 .

[0018] like figure 1 As shown, a slide rail 11 is provided on the frame 1, and a track 22 is provided on the frame 2, and the slide rail 22 is connected with the slide rail 11 to realize the sliding connection between the frame 2 and the frame 1. When the first driving device 4 drives the platform 2 to move, the platform 2 drives the slideway 22 to slide relative to the slide rail 11 .

[0019] The frame 1 is provided with a mounting frame 3, the mounting frame 3 is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a circuit engraving device, in particular to a device for manufacturing a circuit through a liner plate engraving process. A table rack used for fixing a liner plate is arranged on a rack; the table rack is connected with the rack through a first drive device; the rack is connected with a mounting frame; the mounting frame is connected with a supporting plate; a guide railis arranged on the supporting plate; the guide rail is in sliding connection with an engraving machine; a second drive device is arranged on the mounting frame; the second drive device is connected with a screw; the screw is connected with the engraving machine through threads; and the first drive device and the second drive device are connected with a main controller. The device can accurately and quickly engrave out the circuit according to a circuit design drawing, and improves circuit manufacturing efficiency.

Description

technical field [0001] The invention relates to a circuit engraving device, in particular to a device for making a circuit by engraving a lining board. Background technique [0002] In the prior art, although many manufacturing processes for the circuit in the circuit board are provided, most of the manufacturing processes are complicated and costly. Due to the complex structure of the circuit board and the small size, the circuit board in the prior art The production method cannot adapt to the requirements of low cost and high efficiency. Contents of the invention [0003] In order to overcome at least one defect of the above-mentioned prior art, the present invention provides a device for manufacturing circuits by engraving lining boards, which can accurately and quickly carve circuits according to circuit design drawings, and improve the efficiency of circuit manufacturing. [0004] In order to solve the above-mentioned technical problems, the technical solution adopte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B44B3/02B44B3/06H05K3/04
CPCH05K3/04B44B3/02B44B3/06B44B2700/12B44B2700/02
Inventor 梁万龙何建宗
Owner GUANGDONG POWER GRID CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products